Patents by Inventor Jerry Allen Gorrell

Jerry Allen Gorrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140192341
    Abstract: Methods for determining the planarity of two components of a semiconductor processing tool, such as a 3D wafer bonder are disclosed. The two components may be fixtures, chucks, or platens of the tool. A test wafer comprising multiple solder balls is compressed and the deformity of multiple solder balls is measured to assess the planarity of the tool. The measurement of the deformed solder balls may be performed manually, or with an automated wafer inspection tool, which may use lasers to measure the height of each solder ball. The planarity of the two components is computed based on the height of the deformed solder balls.
    Type: Application
    Filed: January 7, 2013
    Publication date: July 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sarah H. Knickerbocker, Jerry Allen Gorrell, Christopher Lee Tessler