Patents by Inventor Jerry Broz
Jerry Broz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10896828Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: June 8, 2020Date of Patent: January 19, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20200303217Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10741420Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: September 20, 2018Date of Patent: August 11, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10406568Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: March 1, 2019Date of Patent: September 10, 2019Assignee: International Test Solutions, Inc.Inventors: Alan Humphrey, Jerry Broz, James H. Duvall
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Publication number: 20190019694Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: September 20, 2018Publication date: January 17, 2019Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10109504Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: January 30, 2017Date of Patent: October 23, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10002776Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: December 21, 2012Date of Patent: June 19, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20170136500Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: January 30, 2017Publication date: May 18, 2017Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 9595456Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: August 20, 2013Date of Patent: March 14, 2017Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20130333128Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: August 20, 2013Publication date: December 19, 2013Applicant: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 7202683Abstract: The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device has a working surface with a particular characteristic (a matte finish or a conductive material) so that a prober is capable of automatically determining the location of the working surface of the cleaning device and therefore operate in an automatic cleaning mode.Type: GrantFiled: April 16, 2004Date of Patent: April 10, 2007Assignee: International Test SolutionsInventors: Gene Humphrey, Jerry Broz, Joyce Adams
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Publication number: 20060065290Abstract: A cleaning device cleaning method is provided wherein the surface of the cleaning device is cleaned of accumulated debris and particulates.Type: ApplicationFiled: September 27, 2005Publication date: March 30, 2006Inventors: Jerry Broz, Alan Humphrey
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Publication number: 20050196900Abstract: A substrate protection system and method are described that, in a preferred embodiment, protect the integrated circuit dies on a semiconductor wafer from damage. A layer of material may be formed over the substrate and the devices formed thereon.Type: ApplicationFiled: March 5, 2004Publication date: September 8, 2005Inventors: Alan Humphrey, Jerry Broz
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Publication number: 20050140382Abstract: A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.Type: ApplicationFiled: February 23, 2005Publication date: June 30, 2005Inventors: Lester Wilson, Reynaldo Rincon, Jerry Broz, Richard Arnold
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Patent number: 6911834Abstract: Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity of probe locations include a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes provides a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.Type: GrantFiled: January 25, 2002Date of Patent: June 28, 2005Assignee: Texas Instruments IncorporatedInventors: Scott W. Mitchell, Reynaldo M. Rincon, Jerry Broz, Gerard Laugier
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Patent number: 6906539Abstract: A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.Type: GrantFiled: July 14, 2001Date of Patent: June 14, 2005Assignee: Texas Instruments IncorporatedInventors: Lester Wilson, Reynaldo M. Rincon, Jerry Broz, Richard W. Arnold
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Publication number: 20050001645Abstract: The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device has a working surface with a particular characteristic (a matte finish or a conductive material) so that a prober is capable of automatically determining the location of the working surface of the cleaning device and therefore operate in an automatic cleaning mode.Type: ApplicationFiled: April 16, 2004Publication date: January 6, 2005Inventors: Alan Humphrey, Jerry Broz, Billie Adams
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Publication number: 20040169521Abstract: A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.Type: ApplicationFiled: January 20, 2004Publication date: September 2, 2004Inventors: Reynaldo M. Rincon, Jerry Broz, Lester Wilson, Richard W. Arnold
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Publication number: 20040115934Abstract: A method for improving the electrical resistance of contacts on an integrated circuit. The method includes the steps of first exposing the contacts to a solvent, thereby removing organic contaminants; and then exposing the contacts to ion bombardment, thereby removing inorganic contaminants. The step of exposing the contacts to ion bombardment can remove a portion of the contact. The method may also include a step of oxidizing the pad to produce an oxide layer of a predetermined thickness. The ion bombardment can be carried out in a parallel plate etch tool or by using the RIE tool used to carry out a previous etch step. Another embodiment of the invention is a method of improving the resistance of contacts on an integrated circuit including the steps of: exposing the contacts to ion bombardment in the presence of a fluorine and oxygen plasma, thereby removing inorganic contaminants; and exposing the contacts to a solvent, thereby removing organic contaminants.Type: ApplicationFiled: December 13, 2002Publication date: June 17, 2004Inventors: Jerry Broz, Cheryl Hartfield, Elizabeth R. Kramer, Randy Pak, Hansley Regan Rampersad, Phillip R. Coffman, Sunny K. Lee
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Patent number: 6720780Abstract: A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.Type: GrantFiled: August 2, 2001Date of Patent: April 13, 2004Assignee: Texas Instruments IncorporatedInventors: Reynaldo M. Rincon, Jerry Broz, Lester Wilson, Richard W. Arnold