Abstract: An electronic device includes a multilevel package substrate, a semiconductor die mounted to the multilevel package substrate, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate. The multilevel package substrate has a first level, a second level, a first metal stack, and a second metal stack. The first metal stack includes a first set of contiguous metal structures of the first and second levels, the second metal stack includes a second set of contiguous metal structures of the first and second levels, the first and second metal stacks are spaced apart from one another, a first metal trace of the first metal stack partially overlaps a second metal trace of the second metal stack, and the first and second metal traces are in different levels of the multilevel package substrate.

Abstract: According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end portions between respective ones of a pair of end sleeves and the boat, coupling a boat clip to the boat, and removing the end sleeves from between the first and second end portions and the boat clip.

Abstract: According to one embodiment of the invention, a system for applying an adhesive substance to an electronic device having a region designated to be coupled to another device is provided. The region has a first shape defined by a first boundary. The system includes a tube having an open end. The system also includes a nozzle having an opening coupled to the open end of the tube. The opening has a second shape that is approximately the same as the first shape.

Abstract: A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesive (125) comprising a plurality of components. The adhesive (125) generally resides between the surface (107) of the substrate (105) and the integrated circuit (115), wherein the integrated circuit is generally bonded to the substrate. The device (100) further comprises a plurality of electrically-conductive bonding pads (122) associated with the surface (107) of the substrate and a plurality of studs (135) respectively formed over the plurality of bonding pads.

Abstract: A substrate via pod structure providing reliable connectivity in array package devices. The reliability is attained by providing a protruding metal stud in the via area, with the stud being connected to a conductive metal trace (which provides conductive path to a bond pad of an integrated circuit). Due to the presence of the metal stud, increased area of contact is obtained between a solder ball and the conductive metal trace. In an embodiment, the stud contains a well surrounded by protruding portions. The slopes of the protruding portions lead to enhanced resistance in different directions to various cohesive forces that would be present during mounting operations, thereby avoiding solder ball cracking problems.

Abstract: According to one embodiment of the invention, a system for applying an adhesive substance to an electronic device having a region designated to be coupled to another device is provided. The region has a first shape defined by a first boundary. The system includes a tube having an open end. The system also includes a nozzle having an opening coupled to the open end of the tube. The opening has a second shape that is approximately the same as the first shape.

Abstract: According to one embodiment of the invention, a method used in attaching die to a substrate includes providing a substrate having a plurality of die attach regions, positioning a dispensing tool having an aperture adjacent a respective one of the die attach regions, positioning the aperture proximate the respective die attach region, dispensing an adhesive through the aperture and onto the respective die attach region, and translating the dispensing tool in a direction perpendicular to a length of the aperture while dispensing the adhesive to form an adhesive region on the respective die attach region. A length of the aperture is greater than a width of the aperture.

Abstract: According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end portions between respective ones of a pair of end sleeves and the boat, coupling a boat clip to the boat, and removing the end sleeves from between the first and second end portions and the boat clip.

Abstract: According to one embodiment of the invention, a system used in auto-boating includes a tape substrate supported by a boat. The tape substrate includes a pair of lateral edges parallel to one another and each having respective first and second ends, and a pair of longitudinal guide strips parallel to one another. One of the longitudinal guide strips extends between the respective first ends of the pair of lateral edges and the other longitudinal guide strip extends between the respective second ends of the pair of lateral edges. The tape substrate also includes a plurality of die attach regions disposed within the area defined by the pair of lateral edges and the pair of longitudinal guide strips. The system further includes a boat clip coupled to the boat such that the tape substrate is sandwiched between the boat and the boat clip. Each longitudinal guide strip includes a pair of tabs disposed at opposite ends thereof such that each tab extends beyond a respective one of the lateral edges.