Patents by Inventor Jerry Chiu

Jerry Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11375194
    Abstract: Systems and method for video compression using conditional entropy coding. An ordered sequence of image frames can be transformed to produce an entropy coding for each image frame. Each of the entropy codings provide a compressed form of image information based on a prior image frame and a current image frame (the current image frame occurring after the prior image frame). In this manner, the compression model can capture temporal relationships between image frames or encoded representations of the image frames using a conditional entropy encoder trained to approximate the joint entropy between frames in the image frame sequence.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: June 28, 2022
    Assignee: UATC, LLC
    Inventors: Jerry Junkai Liu, Shenlong Wang, Wei-Chiu Ma, Raquel Urtasun
  • Publication number: 20220052474
    Abstract: The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 17, 2022
    Inventors: Jerry Chiu, Melanie Beauchemin
  • Patent number: 11197397
    Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: December 7, 2021
    Assignee: Google LLC
    Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
  • Patent number: 11116113
    Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 7, 2021
    Assignee: Google LLC
    Inventors: Jerry Chiu, Abolfazl Sadeghpour, Gregory P. Imwalle
  • Patent number: 11044835
    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 22, 2021
    Assignee: Google LLC
    Inventors: Jerry Chiu, Gregory P. Imwalle, Emad Samadiani
  • Publication number: 20210068309
    Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
  • Patent number: 10869412
    Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: December 15, 2020
    Assignee: Google LLC
    Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
  • Publication number: 20200323100
    Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.
    Type: Application
    Filed: May 28, 2019
    Publication date: October 8, 2020
    Inventors: Jerry Chiu, Abolfazl Sadeghpour, Gregory P. Imwalle
  • Publication number: 20200315069
    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; a vapor chamber mounted on and in conductive thermal contact with the at least one heat generating processor device, the vapor chamber including a housing that defines an inner volume and encloses a working fluid; and a liquid cold plate assembly that includes a top portion mounted to at least one of the vapor chamber or the motherboard assembly and including a heat transfer member that includes an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member and formed on a top surface of the housing of the vapor chamber.
    Type: Application
    Filed: December 6, 2019
    Publication date: October 1, 2020
    Inventors: Jerry Chiu, Gregory P. Imwalle, Emad Samadiani
  • Publication number: 20200187388
    Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).
    Type: Application
    Filed: January 17, 2019
    Publication date: June 11, 2020
    Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
  • Patent number: 10108073
    Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: October 23, 2018
    Assignee: Google LLC
    Inventors: Jerry Chiu, Katherine Stoy, Li-Ping Wang
  • Publication number: 20180259831
    Abstract: A heat transfer apparatus includes a circuit board assembly and an image sensor including a plurality of photodetectors disposed in a semiconductor material. The image sensor is mounted to the circuit board assembly. A thermal strap with a first end is thermally coupled to transfer heat out of the image sensor. A heat sink is thermally coupled to a second end of the thermal strap opposite the first end of the thermal strap to receive heat from the image sensor.
    Type: Application
    Filed: April 13, 2017
    Publication date: September 13, 2018
    Inventors: Jerry Chiu, Katherine Stoy, Li-Ping Wang