Abstract: A thumb guard apparatus comprising a flat panel portion with a front and back side is disclosed. In one embodiment, the thumb guard apparatus comprises a curved portion or lip contiguous to the flat panel portion, wherein the curved portion or lip extends from the flat panel portion and curves away from the back side of the flat panel portion creating a channel. The channel creates a space which guards the thumb of a guitar player and prevents the thumb from moving on or over the top of the neck of the guitar. The flat panel portion of the apparatus may be attached to the back of the neck of the guitar. A method of use is also disclosed.

Abstract: A thumb guard apparatus comprising a flat panel portion with a front and back side is disclosed. In one embodiment, the thumb guard apparatus comprises a curved portion or lip contiguous to the flat panel portion, wherein the curved portion or lip extends from the flat panel portion and curves away from the back side of the flat panel portion creating a channel. The channel creates a space which guards the thumb of a guitar player and prevents the thumb from moving on or over the top of the neck of the guitar. The flat panel portion of the apparatus may be attached to the back of the neck of the guitar. A method of use is also disclosed.

Abstract: A laser located within a casing of an optoelectronic module is operated by heating the laser to an operating temperature at or above the maximum specified, operating temperature of the module casing using a heater device within the module, the laser having operating characteristics at its operating temperature that are sufficient for its required function. The heater device can be separated from the module casing by an insulating layer or by a thermal switch. The thermal switch can include a droplet of thermally conductive fluid displaceable between a first position where it provides a low thermal impedance path between the heater device and the module casing and a second position wherein a high thermal impedance path is provided between the heater device and the module casing.

Abstract: A laser (102) located within a casing (128) of an optoelectronic module (200) is operated by heating the laser (102) to an operating temperature at or above the maximum specified operating temperature of the module casing (128) using a heater device (202) within the module (200), the laser (102) having operating characteristics at its operating temperature that are sufficient for its required function. The heater device (202) can be separated from the module casing (128) by an insulating layer (204) or by a thermal switch. The thermal switch can include a droplet of thermally conductive fluid displaceable between a first position where it provides a low thermal impedance path between the heater device and the module casing and a second position wherein a high thermal impedance path is provided between the heater device and the module casing.