Abstract: Generally, examples described herein relate to methods and apparatus for photomask processing. In an example, a photomask is obtained that is protected by a pellicle during a photolithography process. The photomask is cleaned by performing an etch process on the photomask using an etchant that is selective to etch a first material of the pellicle at a greater rate than each material of the photomask. In some examples, the pellicle includes a rigid material through which radiation is transmitted during the photolithography process.