Abstract: An apparatus for and method of decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

Abstract: An apparatus for testing sensors in a media includes a chamber portion (240) for holding the sensors, tanks (320, 340) for supplying the media to the chamber portion (240) and coupled in parallel to the chamber portion (240), a pressure generator (310) coupled to the tanks (320, 340), and a heat exchanger (323, 324) adjacent to the tanks (320, 340). The media is simultaneously heated to different temperatures and pressurized to different pressures in the tanks (320, 340). Then, the media is delivered from the tanks (320, 340) to the chamber portion (240), and the sensors detect the media at the different temperatures and pressures.

Abstract: A method of etching a semiconductor substrate (11) includes thinning (102) the semiconductor substrate (11), providing (103) a support layer (30) for the semiconductor substrate (11), providing (104) an etch mask (28) over the semiconductor substrate (11), and etching (105) the semiconductor substrate (11) using an etchant mixture of hydrofluoric acid, nitric acid, phosphoric acid, sulfuric acid, and a wetting agent at a temperature below ambient. The method is capable of using one etch step (105) and one etch mask (28) to form a plurality of trenches (12, 13) having the same width (15, 17) but different depths (16, 18) and different orientations. The method can be used to singulate different sizes and configurations of semiconductor dice from the semiconductor substrate (11).

Abstract: An apparatus for and method of decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

Abstract: An apparatus for decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

Abstract: An apparatus for testing electronic devices in hostile media includes an isolation tank (24) which contains an inert or relatively inert material (26) such as fluorinated hydrocarbon liquid. Within the isolation tank (24) submersed in the inert or relatively inert material (26), is at least one test chamber (12) containing hostile and/or volatile test medium (14) such as a fuel mixture. Adjacent to the test chamber (12) and also within isolation tank (24) is a loading chamber (30) via which electronic devices to be tested are coupled to the test tank (12). The loading chamber (30), test tank (12) and isolation tank (24) are all isolated from the ambient environment and are oxygen free because they each contain a gas purge lines (33,35,38) providing an inert or relatively inert gas to a positive pressure within the respective tanks and chamber.

Abstract: An apparatus for and method of decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

Abstract: A non-venting hazardous material liquid dispensing system (25) includes a removable supply vessel (7) coupled to a gas source (1) and a permanent buffer vessel (11). The permanent buffer vessel (11) is additionally coupled through a suction pump (14) to the removable supply vessel (7). The suction pump (14) suctions pressure off the permanent supply vessel (11), transferring the pressure to removable supply vessel (7). The transfer of pressure causes hazardous material liquid (34) to be drawn from the removable supply vessel (7) into permanent buffer vessel (11). The permanent buffer vessel (11) dispenses hazardous material liquid (34) to a process tool.

Abstract: A vacuum chuck (10) holds a semiconductor wafer (56) securely in place during manufacturing processes. An external chuck (12) has a hollow center portion receiving a spindle support (14) and shaft (16). A positive pressure is applied through the shaft to a nozzle assembly (26) that rests on the spindle support. The nozzle assembly is further housed within a cavity in an internal chuck (28) that rests within a cup in the external chuck. The nozzle assembly use a venturi jet (44) to convert the positive pressure to a vacuum. A plurality of vacuum ports (34 and 36) from the cavity of the internal chuck transfer the vacuum to an upper surface (40) of the internal chuck to hold the semiconductor wafer in place. A plurality of exhaust ports (30 and 32) from the cavity of the internal chuck exhaust gases radially across the upper surface (13) of the external chuck toward its perimeter to prevent undesired chemicals from reaching the underside of the semiconductor wafer.

Abstract: A vapor reduction system for a solvent bottle (12) which is performed in an enclosure (11). A timer (23) controls events during a purge cycle. A vent (14) removes vapors from the enclosure to a vapor treatment system. Pressurized gas is forced through the solvent bottle (12) which vaporizes solvent liquid. A receptacle (16) receives solvent liquid and vapor forced from solvent bottle (12). A line (17) removes to solvent liquid from the receptacle (16) to an environmentally safe container. A second line (18) removes solvent vapor from the receptacle (16) to the vapor treatment system. A fire extinguishing system (31) senses and extinguishes any fire which may develop.

Abstract: The disclosure relates to a composition of matter comprising a rock substrate having a coating simulating natural desert varnish which can be developed within a few days, as contrasted to natural desert varnish which requires at least decades to develop in nature. The coating comprises an initial layer of the reaction product of the rock substrate with a solution of an alkali base and a finishing cover comprising the reaction product of the initial layer with a solution of a metallic salt. Optionally, the coating can include an additional covering of sodium hypochlorite.

Abstract: The disclosure teaches a method of simulating natural desert varnish (that requires at least decades to produce by nature) within a few days. The method is broadly exemplified by the steps of applying a strong base followed by application of a soluble iron or manganese salt. Optionally, sodium hypochlorite may be applied as an additional step after the metallic salt application to speed up the process. The resulting product is difficult to distinguish from the natural varnish.

Abstract: An electrical component which includes a circuit element such as a solid electrolytic capacitor arranged within a metallic casing or can. One electrical lead of the component is connected to the casing; the other lead is connected to the circuit element and extends through an opening in the casing. This opening is filled with a first plastic material to seal the circuit element within the casing against environmental conditions. A conformable coating of a second plastic material is disposed over the outer surface of the casing and extends over the edges of the casing into the opening so as to join with the first plastic material disposed in the opening.