Abstract: Disclosed is a split backed pressure sensitive die carrier tape including a flexible carrier member having a plurality of holes formed therein of a size larger than a die to be carried. Two strips of pressure sensitive adhesive tape are placed along the back face of the carrier partially covering each hole in the carrier. The two strips of substantially straight pressure sensitive tape are spaced apart so that a poke up needle can be passed between the pressure sensitive tape and through the hole formed in the carrier without tearing or damaging either strip of pressure sensitive tape. An integrated circuit chip is positioned in the hole in the carrier and secured to the pressure sensitive tapes.