Abstract: A method and service of balancing delay in a circuit design begins with nodes that are to be connected together by a wiring design, or by being supplied with an initial wiring design that is to be altered. The wiring design will have many wiring paths, such as a first wiring path, a second wiring path, etc. Two or more of the wiring paths are designed to have matching timing, such that the time needed for a signal to travel along the first wiring path is about the same time needed for a signal to travel along the second wiring path, the third path, etc. The method/service designs one or all of the wiring paths to make the paths traverse wire segments of about the same length and orientation, within each wiring level that the first wiring path and the second wiring path traverse. Also, this process makes the first wiring path and the second wiring path traverse the wire segments in the same order, within each wiring level that the first wiring path and the second wiring path traverse.

Abstract: A method, system and program product are disclosed for improving an IC design that prioritize failure coefficients of slacks that lead to correction according to their probability of failure. With an identified set of independent parameters, a sensitivity analysis is performed on each parameter by noting the difference in timing, typically on endpoint slacks, when the parameter is varied. This step is repeated for every independent parameter. A failure coefficient is then calculated from the reference slack and the sensitivity of slack for each of the timing endpoints and a determination is made as to whether at least one timing endpoint fails a threshold test. Failing timing endpoints are then prioritized for modification according to their failure coefficients. The total number of runs required is one run that is used as a reference run, plus one additional run for each parameter.

Abstract: A unified test structure having a large number of electronic devices under test is used to characterize both capacitance-voltage parameters (C-V) and current-voltage parameters (I-V) of the devices. The devices are arranged in an array of columnns and rows, and selected by control logic which gates input/output pins that act variously as current sources, sinks, clamps, measurement ports and sense lines. The capacitance-voltage parameter is measured by taking baseline and excited current measurements for different excitation voltage frequencies, calculating current differences between the baseline and excited current measurements, and generating a linear relationship between the current differences and the different frequencies. The capacitance is then derived by dividing a slope of a line representing the linear relationship by the excitation voltage. Different electronic devices may be so tested, including transistors and interconnect structures.

Abstract: Embodiments of the invention provide a method, computer program product, etc. for analysis techniques to reduce simulations to characterize the effect of variations in transistor circuits. A method of simulating transistors in an integrated circuit begins by reducing a group of parallel transistors to a single equivalent transistor. The equivalent transistor is subsequently simulated, wherein only a portion of the parallel transistors are simulated. Next, the integrated circuit is divided into channel-connected components and simulated for the channel-connected components. A table is created for each type of channel-connected component; and parameterized across chip variation equations are calculated from results of the integrated circuit simulation. Moreover, table entries are created, which include a number of transistor types, a number of unique transistor primitive patterns, and/or a number of paths through each of the transistor primitive patterns.

Abstract: A method for reticle design correction and electrical parameter extraction of a multi-cell reticle design. The method including: selecting a subset of cell designs of a multi-cell reticle design, each cell design of the subset of cell designs having a corresponding shape to process, for each cell design of the subset of cell designs determining a respective cell design location of the corresponding shape; determining a common shapes processing rule for all corresponding shapes of each cell design based on the respective cell design locations of each of the corresponding shapes; and performing shapes processing of the corresponding shape only of a single cell design of the subset of cell designs to generate resulting data for the subset of cell designs. Also a computer usable medium including computer readable program code having an algorithm adapted to implement the method for reticle design correction and electrical extraction.

Abstract: Systems and methods are provided for analyzing the timing of circuits, including integrated circuits, by taking into account the location of cells or elements in the paths or logic cones of the circuit. In one embodiment, a bounding region may be defined around cells or elements of interest, and the size of the bounding region may be used to calculate a timing slack variation factor. The size of the bounding region may be adjusted to account for variability in timing delays. In other embodiments, centroids may be calculated using either the location or the delay-weighted location of elements or cells within the path or cone and the centroids used to calculate timing slack variation factor. The timing slack variation factors are used to calculate a new timing slack for the path or logic cone of the circuit.

Abstract: A ring oscillator test structure comprises at least two overlapping rings that are switchable between different numbers of stages. A delay distribution is measured for various numbers of stages in a set of oscillators formed in different locations subject to different systematic delay effects. The delay distributions are analyzed to isolate the systematic and the random contributions to the standard deviation of the distributions.

Abstract: A method for performing input/output (I/O) floor planning on an integrated circuit design is disclosed. User design data related to I/O circuit associated with each package pin is initially collected. The collected user design data is then sorted according to operating conditions. Next, an I/O behavioral model and a package model are chosen based on the sorted data. A simulation deck is dynamically built with appropriate operating conditions. Finally, a simulation is performed through a circuit simulator using the chosen I/O behavioral model and the operating conditions.

Abstract: The invention presents a method of accommodating for across chip line variation (ACLV) and/or changing static timing of an integrated circuit design. The invention first establishes a circuit design having initial timing requirements and an initial voltage supply and also establishes a relationship between gate timing variations caused by voltage supply changes and gate timing variations caused by manufacturing processing changes. Then, according to the customer's orders that change the initial timing requirements to revised timing requirements, the invention changes the initial voltage supply to a revised voltage supply to accommodate the revised timing requirements (and ACLV if desired) based on the relationship between voltage limits and transistor delay. This process of changing the initial voltage supply does not alter the circuit design.

Abstract: Methods for analyzing the timing in integrated circuits and for reducing the pessimism in timing slack calculations in static timing analysis (STA). The methods involve grouping and canceling the delay contributions of elements having similar delays in early and late circuit paths. An adjusted timing slack is calculated using the delay contributions of elements having dissimilar delays. In some embodiments, the delay contributions of elements having dissimilar delays are root sum squared. Embodiments of the invention provide methods for reducing the pessimism due to both cell-based and wire-dependent delays. The delays considered in embodiments of the invention may include delays due to the location of elements in a path.

Abstract: A behavioral modeling technique that captures driver delay. The output characteristics of a typical driver are represented by two basic element types: switching and non-switching. Switching elements are functions of both time-varying and non-time-varying parameters, and non-switching elements are functions of non-time-varying parameters only. The outputs of these elements are characterized and tabulated by applying a DC voltage on the output of the driver and measuring the current through each element. The time-varying switching element are represent by time-controlled resistors. The invention provides a methodology to account for variations in input transition rate, supply voltage(s) or temperature.

Abstract: A method for performing input/output (I/O) floor planning on an integrated circuit design is disclosed. User design data related to I/O circuit associated with each package pin is initially collected. The collected user design data is then sorted according to operating conditions. Next, an I/O behavioral model and a package model are chosen based on the sorted data. A simulation deck is dynamically built with appropriate operating conditions. Finally, a simulation is performed through a circuit simulator using the chosen I/O behavioral model and the operating conditions.

Abstract: A behavioral modeling technique that captures driver delay. The output characteristics of a typical driver are represented by two basic element types: switching and non-switching. Switching elements are functions of both time-varying and non-time-varying parameters, and non-switching elements are functions of non-time-varying parameters only. The outputs of these elements are characterized and tabulated by applying a DC voltage on the output of the driver and measuring the current through each element. The time-varying switching element are represent by time-controlled resistors. The invention provides a methodology to account for variations in input transition rate, supply voltage(s) or temperature.

Abstract: A system and method are described for separating the bulk connections for FETs on a semiconductor wafer from the supply rails, testing the wafer to determine if a shift in the threshold voltage, VT, of certain devices within the wafer, as defined by the bulk-wells, can remove an AC defect in the IC circuit, and tailoring the voltage or voltages applied to the bulk nodes, post-manufacture, such that the integrated circuit meets its performance targets or is sorted to a more valuable performance level. The method requires generating a gate level netlist of the IC's circuitry and performing timing calculations on these circuit netlists using static timing analyses, functional delay simulations, circuit activity analyses, and functional performance testing. The failures are then correlated to respective IC circuits, worst case slack circuits are investigated, and proposed changes to the threshold voltages are employed in the hardware.