Abstract: There is disclosed a novel method for attaching electronic components to an electric circuit printed on a glass substrate. The method comprises depositing a desired quantity of an uncured, ultraviolet radiation-curable, anisotropic conductive adhesive in a desired location on a metallized glass substrate having an electric circuit formed on a surface thereof. An electronic component having electrical contacts formed on a portion thereof is applied to the uncured, deposited adhesive so that the bumps are positioned in the adhesive and in register with desired portions of the electric circuit on the substrate. An amount of pressure sufficient to render the adhesive selectively conductive at locations between the electric circuit and the electrical contact on the electronic component and substantially nonconductive at other locations is applied to the electronic component, such that the electrical contacts make an electrical connection with desired portions of the electric circuit.