Abstract: An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.

Abstract: An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.

Abstract: An improved electroless process for metal-plating a substrate in a plating bath containing metal-plating ions, one or more reducing agents, one or more completing agents, one or more stabilizers and one or more pH adjusters. The improvement comprises adding to the bath an aging composition comprising reaction by-products generated and accumulated in the bath in the course of a plating cycle. The aging composition is present in the bath in a concentration corresponding to the concentration of by-products present in the bath at a desired bath age. The process also involves the continuous or intermittent discharging of a predetermined volume of the bath and the continuous or intermittent replenishment of the bath with one or more replenishing solutions comprising a source of the metal-plating ions, the reducing agents, the complexing agents, the stabilizers and the pH adjusters in a manner so as to maintain the concentration of consumable and non-consumable ingredients in the bath at a steady state.