Abstract: A fabrication process for producing thick film electrical components wherein capacitive and RC components may be provided with extremely low impedance by minimizing inadvertent inductance. The process relies on the use of thick film technology to deposit a plurality of distinct overlying flat layers of appropriate size, shape and materials on an underlying substrate. Use of relatively large area conductive films to form plates of a capacitor, results in a highly precise capacitance with virtually no inductive component. The process employs a series of print, dry and fire steps for each layer of screening on a substrate. The magnitude of the fabricated capacitance is based on the number of capacitor plates screened as well as the area of the plates, the thickness of the dielectric plate between the capacitor plates and the dielectric constant of the dielectric plate.