Abstract: A cooling apparatus includes a chassis, a plurality of heat producing component slots defined by the chassis, and a plurality of valve systems mounted in the chassis, whereby a valve system is positioned adjacent each heat producing component slot. A fan may be coupled to the apparatus and a plurality of heat producing components such as, for example, a plurality of information handling systems, may be positioned in the heat producing components slots and selectively cooled using the plurality of valve systems, depending on the cooling requirements of each individual heat producing component.

Abstract: A method and apparatus for dissipating heat from an electrical device and ducting air from one place to another. In a computer having several heat producing devices, one heat sink is thermally attached to each one of the devices. Each of the heat sinks has a base, two side walls and a top wall forming a passage therebetween. The base, side and top walls are all thermally conductive to the corresponding heat producing device, and therefore each of them radiate heat into the passage. Each of the heat sinks also includes several cooling fins that extend into the passage, thereby increasing the thermal efficiency of the heat sink. Furthermore, the passage is of sufficient size to allow multiple heat sinks to be serially lined up, thereby allowing an air mass to flow from one heat sink to another.

Abstract: A computer device carrier door and bay filler panel combination for sealing a bay in a computer chassis. The door and filler combination includes a door having a mount attached thereto, and a mounting rail for engaging the mount. The rail has an arcuate alignment channel with one open end and an attached rack. The mount includes a pinion gear to rotatably engage the rack as the door is opened and closed and a guide pin which enters the open end of the channel when the door is open and travels within the channel as the door is opened and closed.