Patents by Inventor Jerry Gomez Cayabyab
Jerry Gomez Cayabyab has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11276615Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.Type: GrantFiled: September 17, 2019Date of Patent: March 15, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab
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Patent number: 10811292Abstract: Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.Type: GrantFiled: September 12, 2018Date of Patent: October 20, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Connie Alagadan Esteron, Dolores Babaran Milo, Jerry Gomez Cayabyab
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Publication number: 20200203227Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structures The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome shaped chuck, breaking the perforations in the wafer.Type: ApplicationFiled: March 4, 2020Publication date: June 25, 2020Inventors: Jerry Gomez Cayabyab, Jennifer Otero Aspuria, Julian Carlo Barbadillo, Alvin Lopez Andaya
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Patent number: 10615075Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.Type: GrantFiled: June 13, 2018Date of Patent: April 7, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jerry Gomez Cayabyab, Jeniffer Otero Aspuria, Julian Carlo Concepc Barbadillo, Alvin Lopez Andaya
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Publication number: 20200083076Abstract: Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.Type: ApplicationFiled: September 12, 2018Publication date: March 12, 2020Applicant: Texas Instruments IncorporatedInventors: Connie Alagadan Esteron, Dolores Babaran Milo, Jerry Gomez Cayabyab
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Publication number: 20200013688Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.Type: ApplicationFiled: September 17, 2019Publication date: January 9, 2020Inventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab
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Publication number: 20190385911Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.Type: ApplicationFiled: June 13, 2018Publication date: December 19, 2019Inventors: JERRY GOMEZ CAYABYAB, JENIFFER OTERO ASPURIA, JULIAN CARLO CONCEPC BARBADILLO, ALVIN LOPEZ ANDAYA
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Patent number: 10418294Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.Type: GrantFiled: May 15, 2018Date of Patent: September 17, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab
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Publication number: 20180261568Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.Type: ApplicationFiled: May 11, 2018Publication date: September 13, 2018Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
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Publication number: 20180261567Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.Type: ApplicationFiled: May 8, 2018Publication date: September 13, 2018Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
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Patent number: 9997490Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.Type: GrantFiled: March 20, 2015Date of Patent: June 12, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
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Patent number: 9824959Abstract: A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame, the pad and the leads having a first thickness (115) and a first and an opposite and parallel second surface; the leads having a first portion (112) of first thickness near the gap and a second portion (111) of first thickness near the frame, and a zone (114) of reduced second thickness (116) between the first and second portions; the second surface (112a) of the first lead portions is coplanar with the second surface (111a) of the second portions. A semiconductor chip (220) with a terminal is attached the pad. A metallic wire connection (230) from the terminal to an adjacent lead includes a stitch bond (232) attached to the first surface of the lead.Type: GrantFiled: March 23, 2016Date of Patent: November 21, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dolores Babaran Milo, Mark Gerald Rosario Pinlac, Bobby Johns Lansangan Villacarlos, Jerry Gomez Cayabyab, Juan Carlo Aro Rimando
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Publication number: 20170278776Abstract: A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame, the pad and the leads having a first thickness (115) and a first and an opposite and parallel second surface; the leads having a first portion (112) of first thickness near the gap and a second portion (111) of first thickness near the frame, and a zone (114) of reduced second thickness (116) between the first and second portions; the second surface (112a) of the first lead portions is coplanar with the second surface (111a) of the second portions. A semiconductor chip (220) with a terminal is attached the pad. A metallic wire connection (230) from the terminal to an adjacent lead includes a stitch bond (232) attached to the first surface of the lead.Type: ApplicationFiled: March 23, 2016Publication date: September 28, 2017Inventors: Dolores Babaran Milo, Mark Gerald Rosario Pinlac, Bobby Johns Lansangan Villacarlos, Jerry Gomez Cayabyab, Juan Carlo Aro Rimando
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Publication number: 20160276305Abstract: A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.Type: ApplicationFiled: March 20, 2015Publication date: September 22, 2016Inventors: Ruby Ann Maya Merto, Jerry Gomez Cayabyab, Edsel Gomez Balagtas
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Patent number: 8716845Abstract: A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.Type: GrantFiled: April 15, 2011Date of Patent: May 6, 2014Assignee: Texas Instruments IncorporatedInventors: Norbert Joson Santos, Edgar Dorotayo Balidoy, Anthony Steven Dominisac Panagan, Jerry Gomez Cayabyab, Ferdinand S. Signey
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Publication number: 20120261806Abstract: A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.Type: ApplicationFiled: April 15, 2011Publication date: October 18, 2012Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: NORBERT JOSON SANTOS, EDGAR DOROTAYO BALIDOY, ANTHONY STEVEN DOMINISAC PANAGAN, JERRY GOMEZ CAYABYAB, FERDINAND S. SIGNEY
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Publication number: 20110017806Abstract: A wire bond apparatus and method can include wire bonder head having a capillary there through and a bond wire within the capillary. A forming gas inlet to the capillary allows injection of forming gas directly into the wire bond head capillary. The forming gas can be forced from the end of the capillary to accurately envelop an end of the bond wire in forming gas during free-air ball formation, which can decrease oxidation of the free-air ball during formation, reduce a quantity of forming gas used, and result in a more symmetrical free-air ball and an improved bond wire attachment.Type: ApplicationFiled: July 21, 2009Publication date: January 27, 2011Inventors: Jerry Gomez Cayabyab, Timer D. Porras, Allan I. Dacanay
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Patent number: 7358617Abstract: A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesive (125) comprising a plurality of components. The adhesive (125) generally resides between the surface (107) of the substrate (105) and the integrated circuit (115), wherein the integrated circuit is generally bonded to the substrate. The device (100) further comprises a plurality of electrically-conductive bonding pads (122) associated with the surface (107) of the substrate and a plurality of studs (135) respectively formed over the plurality of bonding pads.Type: GrantFiled: November 29, 2004Date of Patent: April 15, 2008Assignee: Texas Instruments IncorporatedInventors: Mark Gerald Muyco Cruz, Jerry Gomez Cayabyab, Ma. Celine Ramirez Mandapat