Abstract: An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.

Abstract: A method of stretching solder joints between the input/output pads of an electrical component and corresponding input/output pads on a substrate includes the steps of: melting the solder joints; confining the component while the solder joints are melted such that the component can only move substantially perpendicular to the substrate; pulling the component, while the component is confined, by an external force in a direction away from the substrate to thereby stretch the melted solder joints; compelling the movement of the component to stop when the component has moved a predetermined distance; and, solidifying the solder joints while the component is compelled to stop. By stretching the solder joints with the above method, the solder joint shape can be changed from convex to concave; and thermally induced stress/strain in the joint is substantially reduced.

Abstract: An electro-mechanical assembly includes a high power IC package and a low power IC package which are mounted with a space between them on a single substrate. Both of these IC packages have flat top surfaces which dissipate heat; and due to various manufacturing tolerances, those surfaces are non-coplanar with respect to each other. To cool these two IC packages, a single heat sink is provided which has a thin flat core that overlies both of the IC packages as well as the space between them, and cooling fins extend from the top of the core.

Abstract: An electro-mechanical module comprises a packaged electrical part having a surface which dissipates heat, and a springy frame which overlies that surface. This frame includes a pair of fasteners for catching on the package at two predetermined locations, and the frame has an unstressed state in which the fasteners do not coincide with the two locations. However, the frame is springy enough to be stressed and thereby move the fasteners to the two locations, and thereafter return back towards the unstressed state and catch the fasteners on the package at the two locations. To complete the module, a heat sink rests on the surface and is removably attached to the frame.

Abstract: A high density integrated circuit module is comprised of a plurality of integrated circuit chips; each of the chips has top and bottom surfaces and thin sides; and all of the chips are arranged in a stack in which the sides of the chips form multiple faces of the stack. Also, in accordance with the invention, a selected face of the stack has a zigzag shape which exposes a portion of the top surface of each chip on that face; and, bonding pads for carrying input/output signals to/from the chips are located on the exposed top surface portion of the chips. This zigzag shape is produced by (a) providing an indentation in the side of each of the chips which lie along the selected stack face; or (b) by offsetting the sides of the chps from each other as they lie along the selected stack face; or (c) by providing respective spacers between the chips and indenting them from the chips along the selected stack face.

Abstract: A leak in an enclosure of an integrated circuit package is detected by the steps of: filling the enclosure with a first gas at the time the enclosure is sealed; subsequently enveloping the integrated circuit package with a second gas that is different than the first gas; holding the second gas at a constant pressure over a certain time period; and sensing a surface of the enclosure, during the above steps, for the presence of microscopic deflections. If the enclosure has a gross leak, no deflection will occur when the package is initially enveloped with the second gas. If the package has a minor leak, a deflection will occur when the package is initially enveloped with the second gas, and the amount of the deflection will decrease during the holding time period.

Abstract: A liquid cooled integrated circuit module includes a substrate, a plurality of chips mounted on the substrate, and electrical conductors integrated into the substrate to interconnect the chips. A compliant member which is completely seamless overlies all of the chips. This seamless compliant member is hermetically sealed at its perimeter to the substrate around all of the chips. Between this seamless compliant member and the chips are thermally conductive studs, and they carry heat by conduction from the chips to the compliant member. A rigid cover overlies the compliant member, and it is attached to the substrate at its perimeter. Within the cover are several parallel spaced apart ribs which project towards and press against the compliant member between the chips, and they form channels for a liquid coolant which carries heat away from the compliant member.

Abstract: A liquid cooled electronic circuit includes a printed circuit board having two oppositely facing surfaces, electronic components mounted on one of the two surfaces, and conduits which carry a liquid and touch the electronic components to cool them; wherein a frame is also provided for holding the conduits snugly against the components without overstressing the printed circuit board. This frame is characterized as having: (a) a first set of contacts which engage the conduits; (b) a second set of contacts which engage the surface of the printed circuit board opposite the one surface; (c) the contacts of the second set being spaced apart and located at predetermined distances from the board's perimeter; and (d) fasteners for urging the conduits against the electronic components by moving the first and second sets of contacts toward each other with the conduits, the electronic components, and the printed circuit board lying therebetween.

Abstract: A multichip integrated circuit package comprises a thin planar body which has top and bottom major surfaces. Conductors, for carrying electrical signals, are integrated into the body and include input/output terminals on one portion of the bottom surface. Downward-facing cavities for holding respective high power integrated circuit chips extend from another portion of the bottom surface into the body, and upward-facing cavities for holding respective low power integrated circuits extend from the top surface into the body. Small thermal resistance for the high power chips is achieved, and footprint is simultaneously minimized by locating the upward-facing cavities over the terminals.

Abstract: A liquid cooled circuit module comprises an integrated circuit package; a cover having a rim which lies against the integrated circuit package, the cover being shaped to form a passage for the liquid between the integrated circuit package and the cover; a retaining mechanism, which is fastened directly to the integrated circuit package, and which includes a member that extends above the cover; and a spring, which is held in compression between the cover and the retaining mechanism member; the spring being adapted to press the rim against the integrated circuit package with at least a predetermined minimal force which prevents leaks and at the same time not exceed a stress limit in the spring.

Abstract: A leak tolerant cooling system, for cooling electrical components with a liquid comprises: a frame holding a plurality of printed circuit boards, each of which have electrical components attached thereto; a top reservoir, mounted on the frame above the boards, for holding the liquid at atmospheric pressure; a conduit, coupled to the top reservoir and the boards, for conveying the liquid in a downward direction from the top reservoir over the components, the conduit being airtight in the absence of a leak therein; a bottom reservoir, coupled to the conduit below the boards, for receiving the liquid plus any air due to leaks from the conduit, the bottom reservoir being airtight except for a valve which opens in response to a valve control signal; a pump, coupled to the bottom reservoir, for sucking the liquid and air through the conduit at subatmospheric pressures in response to a pump control signal, and for simultaneously returning the liquid to the top reservoir; and a control circuit for generating the pump

Abstract: In an integrated circuit package of the type in which multiple conductors are bonded between an integrated circuit chip and the body of the package, wire bonds are tested for defects by a method which includes the steps of: placing the integrated circuit package in a magnetic field; generating respective currents through the conductors while the package is in the field to thereupon induce a magnetic force; and monitoring the current through the conductors to determine if a bond breaks under the force and causes the current through it to stop.

Abstract: A socket for an integrated circuit package comprises a frame; a plurality of mechanical contacts mounted in the frame such that they align with corresponding pins on the package; a contact deflecting member in the frame which is moved to engage and deflect the contacts against the pins; an actuator in the frame which is manually moved to engage and move the contact deflecting member; and a spring in the frame which engages and is deflected by the actuator when the actuator moves the contact deflecting member; the spring being mounted to deflect in series with the contacts to enable the recited socket components to have dimensional tolerances and yet avoid the overstressing and understressing of the contacts by the contact deflecting member.

Abstract: Tensioning device for use with electromagnetic read/write transducing apparatus wherein a flat elongated band or strip of non-magnetic material is arranged adjacent to a plurality of read/record heads effective to support an item adapted to move between the heads and the tensioning strip and wherein the strip is lever actuated from a relaxed, released condition relative to the heads enabling easy removal and replacement due to wear or breakage into a taut condition and including means to prevent stray magnetic flux from one transducing device from interfering with the magnetic flux of another local transducing device effectively insuring a high level signal output.