Patents by Inventor Jerry J. Berkstresser

Jerry J. Berkstresser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing head for polishing semiconductor wafers
    Patent number: 7364496
    Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: April 29, 2008
    Assignee: Inopla Inc.
    Inventors: David E. Berkstresser, Jerry J. Berkstresser, Jino Park, In-Kwon Jeong
  • POLISHING HEAD FOR POLISHING SEMICONDUCTOR WAFERS
    Publication number: 20070207709
    Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
    Type: Application
    Filed: February 28, 2007
    Publication date: September 6, 2007
    Inventors: David E. Berkstresser, Jerry J. Berkstresser, Jino Park, In-Kwon Jeong