Abstract: Disclosed are thermoplastic resin compositions having improved heat resistance, e.g., IR soldering and HDT; increased ductility and flowability; and reduced flash. In particular, the thermoplastic resin compositions have at least one high heat amorphous resin, at least one polysulfide; and, optionally, at least one reinforcing filler and/or at least one polyolefin and/or at least one polyolefin compound and/or at least one polyepoxy compound. The high heat amorphous resin is preferably a polyetherimide and the polyolefin is preferably a high crystalline polyethylene. The compositions of the invention are particularly well suited for preparing no flash high heat electrical connectors.