Abstract: A comfort device comprising a plurality of elongate inserts is disclosed herein. The comfort device can include one or more compartments configured to store the plurality of elongate inserts. The plurality of elongate inserts can have a length and a cross-section, where the cross-section has a cross-sectional area and a plurality of dimensions. The length of the inserts can be at least eight inches and at least eight times a greatest dimension of the cross-sectional area. The comfort device can include one or more openings and fastening mechanism corresponding to the one or more openings. The plurality of elongate inserts can generate tensional force in response to a force applied to the comfort device, thus providing improved elasticity for the comfort device.

Abstract: A comfort device comprising a plurality of elongate inserts is disclosed herein. The comfort device can include one or more compartments configured to store the plurality of elongate inserts. The plurality of elongate inserts can have a length and a cross-section, where the cross-section has a cross-sectional area and a plurality of dimensions. The length of the inserts can be at least eight inches and at least eight times a greatest dimension of the cross-sectional area. The comfort device can include one or more openings and fastening mechanism corresponding to the one or more openings. The plurality of elongate inserts can generate tensional force in response to a force applied to the comfort device, thus providing improved elasticity for the comfort device.

Abstract: A comfort device comprising a plurality of elongate inserts is disclosed herein. The comfort device can include one or more compartments configured to store the plurality of elongate inserts. The plurality of elongate inserts can have a length and a cross-section, where the cross-section has a cross-sectional area and a plurality of dimensions. The length of the inserts can be at least eight inches and at least eight times a greatest dimension of the cross-sectional area. The comfort device can include one or more openings and fastening mechanism corresponding to the one or more openings. The plurality of elongate inserts can generate tensional force in response to a force applied to the comfort device, thus providing improved elasticity for the comfort device.

Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Abstract: An embodiment of a packaged radio frequency (RF) device includes a device substrate with a voltage reference plane, a first input lead coupled to the device substrate, a first output lead coupled to the device substrate, a first transistor die coupled to a top surface of the device substrate with a solder bond, a second die coupled to the top surface of the device substrate with a conductive epoxy that electrically couples at least one component of the second die to the voltage reference plane, and non-conductive molding compound over the top surface of the device substrate and encompassing the first transistor die, the second die, a portion of the first input lead, and a portion of the first output lead.

Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Abstract: An embodiment of a packaged radio frequency (RF) device includes a device substrate with a voltage reference plane, a first input lead coupled to the device substrate, a first output lead coupled to the device substrate, a first transistor die coupled to a top surface of the device substrate with a solder bond, a second die coupled to the top surface of the device substrate with a conductive epoxy that electrically couples at least one component of the second die to the voltage reference plane, and non-conductive molding compound over the top surface of the device substrate and encompassing the first transistor die, the second die, a portion of the first input lead, and a portion of the first output lead.

Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Abstract: A method for performing failure analysis on a semiconductor device under inspection includes preparing of a device sample using an encapsulation material containing a dye, the prepared device sample possibly including a failure area having wicked in encapsulation material containing the dye. The prepared device sample is then sectioned to facilitate viewing a cross section face of the device under inspection. Lastly, a dark field analysis on the prepared device sample is performed with the use of dark field illumination. Responsive to at least one failure area containing wicked in encapsulation material with dye occurring on the cross section face of the device under inspection, the failure area can be readily identified as well as a contrast and perspective of remaining portions of the cross section face being maintained.

Abstract: A method for forming a microelectronic assembly is provided. A carrier substrate (30) is provided. A sacrificial layer (38) is formed over the carrier substrate. A polymeric layer (40), including a polymeric tape (42) and a polymeric layer adhesive (44), is formed over the sacrificial layer. The polymeric layer adhesive is between the sacrificial layer and the polymeric tape. A microelectronic die (52), having an integrated circuit formed therein, is placed on the polymeric layer. The microelectronic die is encapsulated with an encapsulation material (54) to form an encapsulated structure (58). The polymeric layer and the encapsulated structure are separated from the carrier substrate. The separating of the polymeric layer and the encapsulated structure includes at least partially deteriorating the sacrificial layer.

Abstract: A method of electrically coupling a first substrate (12) and a second substrate (30) includes forming a conductive bump (20) on the first substrate (12) by electroless plating a metal and nonconductive particles (26) together. The first substrate (12) and the second substrate (30) are bonded with a nonconductive polymer (40) so that the conductive bump (20) and a conductive pad (32) of the second substrate 30) are electrically coupled.

Abstract: A method of etching a semiconductor substrate (11) includes thinning (102) the semiconductor substrate (11), providing (103) a support layer (30) for the semiconductor substrate (11), providing (104) an etch mask (28) over the semiconductor substrate (11), and etching (105) the semiconductor substrate (11) using an etchant mixture of hydrofluoric acid, nitric acid, phosphoric acid, sulfuric acid, and a wetting agent at a temperature below ambient. The method is capable of using one etch step (105) and one etch mask (28) to form a plurality of trenches (12, 13) having the same width (15, 17) but different depths (16, 18) and different orientations. The method can be used to singulate different sizes and configurations of semiconductor dice from the semiconductor substrate (11).

Abstract: A method of fabricating a resistive conductive pattern on an aluminum nitride substrate includes forming a resistive chromium containing film on the aluminum nitride substrate and then forming a refractory metal layer on the resistive film. The resistive film and refractory metal layer are then patterned and one or more conductive layers may then be formed on the patterned refractory metal layer. Resistors may then be formed between conductive lines patterned from the layers. These resistors are formed from the resistive film.

Abstract: Metered amounts of air and liquid are mixed to produce a foam which is directed to an applicator. The applicator includes an apertured spreading plate, a bed of porous material, and a contour which converges towards a discharge orifice to uniformly distribute the foam across the orifice.