Patents by Inventor Jerry Leon Wright

Jerry Leon Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit card assembly including heat transfer assembly and method of manufacturing such
    Patent number: 9750127
    Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: August 29, 2017
    Assignee: General Electric Company
    Inventors: Joo Han Kim, Michelle Ann Parziale, Jerry Leon Wright, Hendrik Pieter Jacobus de Bock, Brian Patrick Hoden
  • CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD OF MANUFACTURING SUCH
    Publication number: 20170164459
    Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.
    Type: Application
    Filed: December 4, 2015
    Publication date: June 8, 2017
    Inventors: Joo Han Kim, Michelle Ann Parziale, Jerry Leon Wright, Hendrik Pieter Jacobus de Bock, Brian Patrick Hoden
  • MEZZANINE FILLER MODULE APPARATUSES AND METHODS FOR COMPUTING DEVICES
    Publication number: 20170147044
    Abstract: Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.
    Type: Application
    Filed: November 23, 2015
    Publication date: May 25, 2017
    Inventors: David S. Slaton, Jerry Leon Wright, Brian Patrick Hoden