Abstract: According to one or more embodiments, a semiconductor package includes: a first semiconductor chip including an upper surface, a lower surface, and a side surface and including a chip pad provided on the upper surface; a first cover insulating layer covering the upper surface and the side surface of the first semiconductor chip; a first upper conductive layer extending along an upper surface of the first cover insulating layer and connected to the chip pad of the first semiconductor chip; a first side conductive layer extending along a side surface of the first cover insulating layer and connected to the first upper conductive layer; a second cover insulating layer covering the first upper conductive layer, the first side conductive layer, and the first cover insulating layer; and a first lower conductive layer extending along the lower surface of the first semiconductor chip and connected to the first side conductive layer.

Abstract: A semi-conductor device (100) comprises an exposed leadframe (10) with a die pad (11) and a plurality of leads (12). The die pad (11) has a substantially flat bottom surface (14) and a top surface (15). A semi-conductor die (2) is attached to a die attachment portion (31) of the top surface (15). Downbonds (5) connect the die (2) to a downbond attachment portion (32). Standard bonds (4) connect the die (2) to the leads (12). A plastic package (6) encapsulates the die (2), the standard bonds (4) and the downbonds (5). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition (36) is located between the die (2) and the downbonds (5). It has been found that such step-shaped transition provides good protection against downbond failure.

Abstract: A semi-conductor device (100) comprises an exposed leadframe (10) with a die pad (11) and a plurality of leads (12). The die pad (11) has a substantially flat bottom surface (14) and a top surface (15). A semi-conductor die (2) is attached to a die attachment portion (31) of the top surface (15). Downbonds (5) connect the die (2) to a downbond attachment portion (32). Standard bonds (4) connect the die (2) to the leads (12). A plastic package (6) encapsulates the die (2), the standard bonds (4) and the downbonds (5). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition (36) is located between the die (2) and the downbonds (5). It has been found that such step-shaped transition provides good protection against downbond failure.