Abstract: A waveguide-to-microstrip transition (30) for converting and directing electromagnetic wave signals to an electronic signal processing component (53). A waveguide (32) directs the signals to a waveguide input and is received by a probe (36). A bent microstrip line (40A) which is connected to the probe (36) directs the received signals from the probe (36) to the electronic signal processing component (53). An output port (43) provides a connection between the bent microstrip line (40A) and the electronic signal processing component (53). The output port (43) is not inline with respect to the probe (36), but the microstrip line (40A) includes a bend so as to direct the received signals from the probe (36) to the output port (43).

Abstract: An ultra precision net shape forming process is disclosed which can satisfy the requirements of MMW and sub-MMW components and sabots for small caliber armor piercing ammunition. The process is well suited to both moderate and high volume applications, and offers the potential for dramatically reducing piece part fabrication costs. The process involves closely controlled high temperature compression forming of metals with cycle times of the order of one minute or less, precise replication of all die features, and very low residual stresses. The ultra precision net shape forming cycle starts following insertion of the billet/blank into an open die. In the preheat phase the press is closed to preheat position where the billet/blank is enclosed in both halves of the die but no force is applied. Following preheat the part is formed employing displacement and force control to insure a fully formed part. After holding for a preset time at the peak force, the press is then commanded back to the loading position.

Abstract: An H-plane waveguide probe includes a microstrip formed on a dielectric substrate with a loop conductor generally configured in the shape of waveguide on one side and adapted to capture an incoming H-plane signal. A transition conductor formed on an opposing side of the substrate with a first leg and a second leg, connected together by a bend portion. The first leg of the transition conductor is generally parallel to the H-plane for coupling microwave energy from the waveguide to the microstrip. The second leg of the transition conductor is parallel to the E-field and is used to change the direction of the captured microwave energy along the H-plane direction to the E-plane direction. In order to optimize power transfer, the impedance of the loop conductor is selected to be about the same as the waveguide. The transition conductor is used to convert the E-field energy to a 50&OHgr; impedance, for example, for connection to an external microwave circuit.