Patents by Inventor Jerry Michael Brooks

Jerry Michael Brooks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure having stacked semiconductor devices
    Patent number: 7193306
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: March 20, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Jerry Michael Brooks
  • Semiconductor structure having stacked semiconductor devices
    Publication number: 20030209791
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Application
    Filed: April 8, 2003
    Publication date: November 13, 2003
    Inventors: Salman Akram, Jerry Michael Brooks
  • Semiconductor structure having stacked semiconductor devices
    Patent number: 6603198
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: August 5, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Jerry Michael Brooks
  • Method of manufacturing a semiconductor structure having stacked semiconductor devices
    Patent number: 6531337
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: March 11, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Jerry Michael Brooks
  • Method of manufacturing a semiconductor structure having stacked semiconductor devices
    Patent number: 6531338
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: March 11, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Jerry Michael Brooks
  • Method of manufacturing a semiconductor structure having stacked semiconductor devices
    Publication number: 20020187587
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Application
    Filed: July 31, 2002
    Publication date: December 12, 2002
    Inventors: Salman Akram, Jerry Michael Brooks
  • Semiconductor structure having stacked semiconductor devices
    Publication number: 20020011676
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 31, 2002
    Inventors: Salman Akram, Jerry Michael Brooks
  • Semiconductor structure having stacked semiconductor devices
    Patent number: 6313522
    Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: November 6, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Jerry Michael Brooks