Abstract: Method of manufacturing a piezoelectric actuator. The method includes a pre-cure step in which the adhesive is heated to a temperature below the melting point of the adhesive. A stack is formed having a piezoelectric layer and at least one supporting layer with the pre-cured adhesive therebetween. The stack is then cured to form a bonded laminate. The temperature at which the pre-cure occurs allows for the pre-stress in the piezoelectric layer to be modified without changing the material of the supporting layer.

Abstract: A pre-stressed piezoelectric actuator is comprised of a plurality of layers. The layers include at least one electrically-active ceramic layer, a reinforcing substrate, and a top layer. Preferably, the top layer is comprised of a copper material having at least one lead integrally formed therewith, the lead being available for attaching the device to a voltage source. The copper layer further has a plurality of apertures defined therein to compensate for the stiffness of the copper and to allow the copper layer to deform. The layers are bonded by a thermally-activated adhesive. When the layers and adhesive are heated and cooled, the higher coefficients of thermal expansion in the substrate and top layers stresses the ceramic and causes the device to cool into an arcuate shape.

Abstract: Method of manufacturing a piezoelectric actuator. The method includes a pre-cure step in which the adhesive is heated to a temperature below the melting point of the adhesive. A stack is formed having a piezoelectric layer and at least one supporting layer with the pre-cured adhesive therebetween. The stack is then cured to form a bonded laminate. The temperature at which the pre-cure occurs allows for the pre-stress in the piezoelectric layer to be modified without changing the material of the supporting layer.

Abstract: A pre-stressed piezoelectric actuator is comprised of a plurality of layers. The layers include at least one electrically-active ceramic layer, a reinforcing substrate, and a top layer. Preferably, the top layer is comprised of a copper material having at least one lead integrally formed therewith, the lead being available for attaching the device to a voltage source. The copper layer further has a plurality of apertures defined therein to compensate for the stiffness of the copper and to allow the copper layer to deform. The layers are bonded by a thermally-activated adhesive. When the layers and adhesive are heated and cooled, the higher coefficients of thermal expansion in the substrate and top layers stresses the ceramic and causes the device to cool into an arcuate shape.