Patents by Inventor Jerry R. Carpenter

Jerry R. Carpenter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile semiconductor package
    Patent number: 4845545
    Abstract: A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.
    Type: Grant
    Filed: February 13, 1987
    Date of Patent: July 4, 1989
    Assignee: International Rectifier Corporation
    Inventors: Howard M. Abramowitz, Jerry R. Carpenter, Dennis Meddles