Patents by Inventor Jerry R. Kukulka
Jerry R. Kukulka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8664517Abstract: A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.Type: GrantFiled: September 6, 2012Date of Patent: March 4, 2014Assignee: The Boeing CompanyInventor: Jerry R. Kukulka
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Publication number: 20120329199Abstract: A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.Type: ApplicationFiled: September 6, 2012Publication date: December 27, 2012Applicant: The Boeing CompanyInventor: Jerry R. Kukulka
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Patent number: 8283558Abstract: A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.Type: GrantFiled: March 27, 2009Date of Patent: October 9, 2012Assignee: The Boeing CompanyInventor: Jerry R. Kukulka
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Patent number: 8044295Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: GrantFiled: September 7, 2007Date of Patent: October 25, 2011Assignee: The Boeing Company, Inc.Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
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Publication number: 20100243038Abstract: A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.Type: ApplicationFiled: March 27, 2009Publication date: September 30, 2010Applicant: THE BOEING COMPANYInventor: Jerry R. Kukulka
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Patent number: 7687386Abstract: A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded within the semiconductor contact layer. Furthermore, the metal migration semiconductor barrier layer may be located underneath or above and in intimate contact with the semiconductor contact layer. The metal migration semiconductor barrier layer and the semiconductor contact layer form a contact structure that prevents metals from migrating from the metal contact into the semiconductor active layer during long-term exposure to high temperatures.Type: GrantFiled: February 20, 2007Date of Patent: March 30, 2010Assignee: The Boeing CompanyInventors: Hojun Yoon, Richard King, Jerry R. Kukulka, James H. Ermer, Maggy L. Lau
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Patent number: 7335835Abstract: A solar cell structure includes a solar cell having a front side and a back side and an active semiconductor structure. The solar cell produces a voltage when the front side is illuminated. The solar cell is protected by a by-pass diode structure including a by-pass diode positioned at the back side of the solar cell. A first electrical interconnection structure extends between the back side of the solar cell and the first diode terminal, and a second electrical interconnection structure extends between the front side of the solar cell and the second diode terminal. An entire length of the second electrical interconnection structure contacts the solar cell.Type: GrantFiled: November 8, 2002Date of Patent: February 26, 2008Assignee: The Boeing CompanyInventors: Jerry R. Kukulka, David R. Lillington
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Patent number: 7285720Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: GrantFiled: July 21, 2003Date of Patent: October 23, 2007Assignee: The Boeing Company, Inc.Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
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Patent number: 7202542Abstract: A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded within the semiconductor contact layer. Furthermore, the metal migration semiconductor barrier layer may be located underneath or above and in intimate contact with the semiconductor contact layer. The metal migration semiconductor barrier layer and the semiconductor contact layer form a contact structure that prevents metals from migrating from the metal contact into the semiconductor active layer during long-term exposure to high temperatures.Type: GrantFiled: December 17, 2003Date of Patent: April 10, 2007Assignee: The Boeing CompanyInventors: Hojun Yoon, Richard King, Jerry R. Kukulka, James H. Ermer, Maggy L. Lau
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Patent number: 6784358Abstract: A solar cell structure includes a solar cell that produces a voltage when illuminated, and a discrete amorphous silicon by-pass diode. A first by-pass diode terminal of the amorphous silicon by-pass diode is electrically connected to a first side of an active semiconductor structure of the solar cell, and a second by-pass diode terminal of the amorphous silicon by-pass diode is electrically connected to a second side of the active semiconductor structure. Alternatively, the first by-pass diode terminal of the amorphous silicon by-pass diode may be electrically connected to the first side of the active semiconductor structure of the solar cell, and the second by-pass diode terminal of the amorphous silicon by-pass diode may be electrically connected to a second side of the active semiconductor structure of another solar cell.Type: GrantFiled: November 8, 2002Date of Patent: August 31, 2004Assignee: The Boeing Co.Inventor: Jerry R. Kukulka
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Publication number: 20040089339Abstract: A solar cell structure includes a solar cell having a front side and a back side and an active semiconductor structure. The solar cell produces a voltage when the front side is illuminated. The solar cell is protected by a by-pass diode structure including a by-pass diode positioned at the back side of the solar cell. A first electrical interconnection structure extends between the back side of the solar cell and the first diode terminal, and a second electrical interconnection structure extends between the front side of the solar cell and the second diode terminal. An entire length of the second electrical interconnection structure contacts the solar cell.Type: ApplicationFiled: November 8, 2002Publication date: May 13, 2004Inventors: Jerry R. Kukulka, David R. Lillington
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Publication number: 20040089338Abstract: A solar cell structure includes a solar cell that produces a voltage when illuminated, and a discrete amorphous silicon by-pass diode. A first by-pass diode terminal of the amorphous silicon by-pass diode is electrically connected to a first side of an active semiconductor structure of the solar cell, and a second by-pass diode terminal of the amorphous silicon by-pass diode is electrically connected to a second side of the active semiconductor structure. Alternatively, the first bypass diode terminal of the amorphous silicon by-pass diode may be electrically connected to the first side of the active semiconductor structure of the solar cell, and the second by-pass diode terminal of the amorphous silicon by-pass diode may be electrically connected to a second side of the active semiconductor structure of another solar cell.Type: ApplicationFiled: November 8, 2002Publication date: May 13, 2004Inventor: Jerry R. Kukulka
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Patent number: 5616185Abstract: An integrated solar cell-bypass diode assembly is provided by forming at least one recess in the back (non-illuminated) side of the solar cell and placing at least one discrete low-profile bypass diode in respective recesses so that each bypass diode is approximately flush with the back side of the solar cell. Each bypass diode is bonded to the solar cell for anti-parallel connection across the solar cell. The back side of the solar cell is preferably formed with a honeycomb pattern of recesses to reduce the weight of the solar cell while maintaining mechanical strength. The recesses that receive bypass diodes preferably have a rectangular shape that better accommodates the bypass diode.Type: GrantFiled: October 10, 1995Date of Patent: April 1, 1997Assignee: Hughes Aircraft CompanyInventor: Jerry R. Kukulka