Patents by Inventor Jerry R Orr

Jerry R Orr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-chip via interconnects for stacked integrated circuit structures
    Patent number: 7911066
    Abstract: A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: March 22, 2011
    Assignee: Agilent Technologies, Inc.
    Inventors: Eric R Ehlers, Jim Clatterbaugh, Mathias Bonse, Timothy E Shirley, Jerry R Orr
  • Through-Chip Via Interconnects for Stacked Integrated Circuit Structures
    Publication number: 20090057872
    Abstract: A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Inventors: Eric R. Ehlers, Jim Clatterbaugh, Mathias Bonse, Timothy E. Shirley, Jerry R. Orr