Patents by Inventor Jerry S. Cupples

Jerry S. Cupples has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated-circuit leadframe adapted for a simultaneous bonding operation
    Patent number: 4722060
    Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: January 26, 1988
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla, Jerry S. Cupples, Barbara R. Mozdzen, Linda S. Wilson, Linn Garrison
  • Process of forming integrated circuits with contact pads in a standard array
    Patent number: 4685998
    Abstract: An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.
    Type: Grant
    Filed: October 9, 1986
    Date of Patent: August 11, 1987
    Assignee: Thomson Components - Mostek Corp.
    Inventors: Quinn, Daniel J., Wayne A. Mulholland, Robert H. Bond, Michael A. Olla, Jerry S. Cupples, Ilya L. Tsitovsky, Barbara R. Mozdzen, Charles F. Held, Linda S. Wilson, Yen T. Nguyen