Abstract: A heat sink comprises skived fins and a base. The base has a first side and a second side. The skived fins are disposed on the first side, and at least one semiconductor device is mounted on the second side. The base has at least one channel for gas flow between the first side and the second side. The skived fins are formed by skiving segments from at least one layer of an alloy. The skived fins have one or more of the following patterns: a wavy skived pattern; a triangular skived pattern; and a block skived pattern.