Patents by Inventor Jerry Simchuk

Jerry Simchuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diffuser with spiral opening pattern for electroplating reactor vessel
    Patent number: 6881309
    Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: April 19, 2005
    Assignee: Semitool, Inc.
    Inventors: Kyle M. Hanson, Robert A. Weaver, Jerry Simchuk, Raymon F. Thompson
  • Diffuser with spiral opening pattern for electroplating reactor vessel
    Publication number: 20020046942
    Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.
    Type: Application
    Filed: June 14, 2001
    Publication date: April 25, 2002
    Inventors: Kyle M. Hanson, Robert A. Weaver, Jerry Simchuk, Raymon F. Thompson
  • Diffuser with spiral opening pattern for an electroplating reactor vessel
    Patent number: 6254742
    Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: July 3, 2001
    Assignee: Semitool, Inc.
    Inventors: Kyle M. Hanson, Robert A. Weaver, Jerry Simchuk, Raymon F. Thompson