Abstract: A shoe system is provided that comprises a removable upper unit and a sole unit that can be interconnected utilizing respective upper and lower connecting means. The sole unit can include a support panel that can extend substantially continuously about a periphery of the sole unit. A lower portion of the support panel can be connected to an interior area of the sole unit and an upper portion can extend generally upwardly from the lower portion and be disposed circumferentially within the interior of a lower connecting means along the sole periphery. The support panel can be so configured so as to provide structural strength to the shoe system when worn to resist transverse force and reduce tactile friction of the user's foot against the upper and lower connecting means.

Abstract: A shoe system is provided that comprises an upper unit, a sole unit, and a support structure. The upper unit and the sole unit can be interconnected utilizing respective upper and lower connecters. The support structure can define a first portion that is coupled to the sole unit. The support structure can extend inwardly from a periphery of the sole unit and extend above a lower edge of the upper unit when the sole unit is coupled to the upper unit.

Abstract: A shoe system is provided that comprises a removable upper unit and a sole unit that can be interconnected utilizing respective upper and lower connecting means. The sole unit can include a support panel that can extend substantially continuously about a periphery of the sole unit. A lower portion of the support panel can be connected to an interior area of the sole unit and an upper portion can extend generally upwardly from the lower portion and be disposed circumferentially within the interior of a lower connecting means along the sole periphery. The support panel can be so configured so as to provide structural strength to the shoe system when worn to resist transverse force and reduce tactile friction of the user's foot against the upper and lower connecting means.

Abstract: A shoe system is provided that comprises a removable upper unit and a sole unit that can be interconnected utilizing respective upper and lower connecting means. The sole unit can include a support panel that can extend substantially continuously about a periphery of the sole unit. A lower portion of the support panel can be connected to an interior area of the sole unit and an upper portion can extend generally upwardly from the lower portion and be disposed circumferentially within the interior of a lower connecting means along the sole periphery. The support panel can be so configured so as to provide structural strength to the shoe system when worn to resist transverse force and reduce tactile friction of the user's foot against the upper and lower connecting means.

Abstract: A shoe system is provided that comprises a removable upper unit and a sole unit that can be interconnected utilizing respective upper and lower connecting means. The sole unit can include a support panel that can extend substantially continuously about a periphery of the sole unit. A lower portion of the support panel can be connected to an interior area of the sole unit and an upper portion can extend generally upwardly from the lower portion and be disposed circumferentially within the interior of a lower connecting means along the sole periphery. The support panel can be so configured so as to provide structural strength to the shoe system when worn to resist transverse force and reduce tactile friction of the user's foot against the upper and lower connecting means.

Abstract: The present invention configures a control strategy and a process model to calculate a setting of a machine. The present invention adjusts the process model in accordance with an analysis of the setting to control the machine.

Abstract: A system (60) and method for monitoring, evaluating and controlling the uniformity of a semiconductor wafer fabrication process is provided for use in manufacturing integrated circuits on semiconductor wafers (40). By using in situ ellipsometry (20) in conjunction with statistical modeling methods, the spatial etch rate pattern across a semiconductor wafer (40) may be inferred as a function of the process conditions. A predicted mean etch rate may be calculated for other locations (46 and 48) on the semiconductor wafer surface (42) by using the mean etch rate measured at the selected ellipsometer site (44) and individual spatial etch rate models developed for each site (44 and 48) based on statistically designed experiments. The predicted mean etch rate at the other sites (46 and 48) is also a function of the fabrication process conditions.