Abstract: A method of, and system for, providing an amorphous fluorinated polymer conformal coating to an RF circuit board is described. A coating solution including the amorphous fluorinated polymer dissolved in a fluorinated solvent is provided. The coating solution is applied to the RF circuit board via a mechanically controlled fluid spray application device to produce a coated board. A predetermined time period is waited for substantial evaporation of the fluorinated solvent from the coated board, thus leaving behind a conformal coating of the amorphous fluorinated polymer on a board surface area.

Abstract: A method of controlling alloy composition of deposited gold-tin alloy during electroplating of a large panel includes masking at least one planar surface of the panel with conductive material applied in a predetermined pattern. The masked panel is located at least partially within an electroplating solution including a gold-tin alloy in solution at a predetermined gold:tin ratio. Electrical current applied to the masked panel is conducted across the planar surface via the conductive material to induce a predetermined electrical current distribution across the planar surface and thereby pull gold ions and tin ions from the electroplating solution. The pulled ions are deposited upon a supermajority of an unmasked area of the masked panel. The predetermined pattern is selected to achieve deposition of the gold-tin alloy with substantially uniform alloy composition, directly corresponding to the predetermined gold:tin ratio, across the supermajority of the unmasked area of the masked panel.

Abstract: An integrated getter structure and a method for its formation and installation in a circuit module enclosure (24). The integrated structure includes a hydrogen getter structure (10) and selected quantities of a material (20) that is formulated to provide both a particle getter function and an RF absorber function. In one embodiment, the material (20) is placed in discrete quantities over the hydrogen getter structure (10). In another embodiment, the hydrogen getter structure (10) is formed over a sheet of the material (20) and is provided with apertures (30) to expose the material (20).

Abstract: Disclosed are hydrogen gettering structure (11) and use of such structure and methods of forming such structure. The hydrogen gettering structure (11) includes a titanium member (1) and a silver-doped palladium layer (3) on the titanium member (1), the silver assisting palladium to increase the hydrogen gettering. The silver-doped palladium can be deposited on the titanium member by sputtering. The hydrogen gettering structure (11) can be attached to a semiconductor module component (7) and incorporated in a semiconductor module (10) to increase hydrogen gettering, or can be included in other structure (e.g., nuclear reactor structure) where absorption or gettering of hydrogen is necessary or desired.