Patents by Inventor Jerry T. HARRIS

Jerry T. HARRIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL ORGANIC FRAMEWORKS (MOFS) FILLER FOR ENABLING LOW CTE AND LOW DIELECTRIC CONSTANT PCB
    Publication number: 20230309220
    Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substrate is coupled to the PCB, and a die is coupled to the package substrate.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 28, 2023
    Inventors: Yang JIAO, Kyle DAVIDSON, Srinivasa ARAVAMUDHAN, Jerry T. HARRIS