Abstract: A semiconductor device package includes a first substrate having an electrical circuit, semiconductor dies stacked one on top of the other, and bond wires electrically connected one to another. The bond wires electrically couple the semiconductor dies to one another and to the electrical circuit. There is a first bond wire having a first portion connected to a first semiconductor die, a second portion connected to a second semiconductor die, and an intermediate portion between the first portion and second portion. The semiconductor device package further includes a molding compound encapsulating the semiconductor dies, and the first and second portions of the first bond wire. The intermediate portion of the first bond wire is exposed along a top planar surface of the molding compound. The semiconductor device package may be used for coupling one or more other semiconductor device packages thereto via the exposed intermediate portion.

Abstract: Formulation of ectoparasiticidal and antibiotic “compositions into pharmaceutical compositions useful for the treatment of eyelid inflammation, in particular demodex related blepharitis and eye crusting.

Abstract: A computer-implemented method can include receiving a first image input from a user, determining values of biological properties of the user, determining a first formulation, controlling a plurality of servomotors, receiving a second image input from a user, determining a second value of one of the biological properties of the user, comparing the first and second values, changing another of the values, determining a second formulation, and again controlling the plurality of servomotors. The image inputs can include images of the users skin. The values can be representative of a sensitivity of the user's skin to one or more materials and a current level of irritation of the user's skin. The formulations can contain a plurality of materials and can be configured to inhibit irritation of the user's skin based on the values of the biological properties of the skin.

Abstract: Formulation of ectoparasiticidal and antibiotic “compositions into pharmaceutical compositions useful for the treatment of eyelid inflammation, in particular demodex related blepharitis and eye crusting.

Abstract: A computer-implemented method can include receiving a first image input from a user, determining values of biological properties of the user, determining a first formulation, controlling a plurality of servomotors, receiving a second image input from a user, determining a second value of one of the biological properties of the user, comparing the first and second values, changing another of the values, determining a second formulation, and again controlling the plurality of servomotors. The image inputs can include images of the users skin. The values can be representative of a sensitivity of the user's skin to one or more materials and a current level of irritation of the user's skin. The formulations can contain a plurality of materials and can be configured to inhibit irritation of the user's skin based on the values of the biological properties of the skin.

Abstract: A computer-implemented method can include receiving a first image input from a user, determining values of biological properties of the user, determining a first formulation, controlling a plurality of servomotors, receiving a second image input from a user, determining a second value of one of the biological properties of the user, comparing the first and second values, changing another of the values, determining a second formulation, and again controlling the plurality of servomotors. The image inputs can include images of the user's skin. The values can be representative of a sensitivity of the user's skin to one or more materials and a current level of irritation of the user's skin. The formulations can contain a plurality of materials and can be configured to inhibit irritation of the user's skin based on the values of the biological properties of the skin.

Abstract: A method is described for detecting and treating an individual subject having an increased risk for acne scarring.

Abstract: Formulation of ectoparasiticidal and antibiotic “compositions into pharmaceutical compositions useful for the treatment of eyelid inflammation, in particular demodex related blepharitis and eye crusting.

Abstract: A computer-implemented method can include receiving a first image input from a user, determining values of biological properties of the user, determining a first formulation, controlling a plurality of servomotors, receiving a second image input from a user, determining a second value of one of the biological properties of the user, comparing the first and second values, changing another of the values, determining a second formulation, and again controlling the plurality of servomotors. The image inputs can include images of the user's skin. The values can be representative of a sensitivity of the user's skin to one or more materials and a current level of irritation of the user's skin. The formulations can contain a plurality of materials and can be configured to inhibit irritation of the user's skin based on the values of the biological properties of the skin.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of high-aspect-ratio leads, each coupled at a first end to a contact pad of the package, and at a second end to a semiconductor die mounted to the die paddle. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and leads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and leads, and to thin a portion of each of the leads. Back surfaces of the leads remain exposed at a back face of the body. The thinned portions of the leads are covered with a dielectric. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of leads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of high-aspect-ratio leads, each coupled at a first end to a contact pad of the package, and at a second end to a semiconductor die mounted to the die paddle. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and leads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and leads, and to thin a portion of each of the leads. Back surfaces of the leads remain exposed at a back face of the body. The thinned portions of the leads are covered with a dielectric. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of leads on one side of the substrate and a plurality of cavities on the opposite face.