Abstract: A semiconductor wafer high purity cleaning apparatus for cleaning large semiconductor wafers of 200 mm in diameter and is intended for circuitry in small geometric structures of 0.3 Microns or less. The apparatus includes successively arranged wafer loading, washing, drying and unloading stations, each having an individual closable enclosure. Also included in the apparatus is a device for storing a number of wafers in a vertical plane within the enclosures of the loading and unloading stations, a device for transporting a sequence of individual wafers, a device for rotating the wafers and a high pressure jet for simultaneously cleaning opposite surfaces of the wafers.