Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property.

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.