Patents by Inventor Jerry Winkler

Jerry Winkler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10370761
    Abstract: A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution channel disposed within the body in a plane intersecting the longitudinal axis of the bore, and a plurality of supply channels disposed within the body and in flow communication with the first distribution channel and with the bore. Each of the first supply channels is disposed at an acute angle with respect to the longitudinal axis of the bore, and each of the supply channels connects with the bore at a different angular position about the longitudinal axis. The distribution channel (and thus, the supply channels) can be connected with a common reactant source. Related deposition methods are also described.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: August 6, 2019
    Assignee: ASM AMERICA, INC.
    Inventors: Todd Dunn, Carl White, Mike Halpin, Eric Shero, Herbert Terhorst, Jerry Winkler
  • Patent number: 10266946
    Abstract: A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution channel disposed within the body in a plane intersecting the longitudinal axis of the bore, and a plurality of supply channels disposed within the body and in flow communication with the first distribution channel and with the bore. Each of the first supply channels is disposed at an acute angle with respect to the longitudinal axis of the bore, and each of the supply channels connects with the bore at a different angular position about the longitudinal axis. The distribution channel (and thus, the supply channels) can be connected with a common reactant source. Related deposition methods are also described.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 23, 2019
    Assignee: ASM AMERICA, INC.
    Inventors: Todd Dunn, Carl White, Mike Halpin, Eric Shero, Herbert Terhorst, Jerry Winkler
  • Publication number: 20190043962
    Abstract: A process for depositing titanium aluminum or tantalum aluminum thin films comprising nitrogen on a substrate in a reaction space can include at least one deposition cycle. The deposition cycle can include alternately and sequentially contacting the substrate with a vapor phase Ti or Ta precursor and a vapor phase Al precursor. At least one of the vapor phase Ti or Ta precursor and the vapor phase Al precursor may contact the substrate in the presence of a vapor phase nitrogen precursor.
    Type: Application
    Filed: June 4, 2018
    Publication date: February 7, 2019
    Inventors: Suvi Haukka, Michael Givens, Eric Shero, Jerry Winkler, Petri Räisänen, Timo Asikainen, Chiyu Zhu, Jaakko Anttila
  • Patent number: 10002936
    Abstract: A process for depositing titanium aluminum or tantalum aluminum thin films comprising nitrogen on a substrate in a reaction space can include at least one deposition cycle. The deposition cycle can include alternately and sequentially contacting the substrate with a vapor phase Ti or Ta precursor and a vapor phase Al precursor. At least one of the vapor phase Ti or Ta precursor and the vapor phase Al precursor may contact the substrate in the presence of a vapor phase nitrogen precursor.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: June 19, 2018
    Assignee: ASM IP HOLDING B.V.
    Inventors: Suvi Haukka, Michael Givens, Eric Shero, Jerry Winkler, Petri Räisänen, Timo Asikainen, Chiyu Zhu, Jaakko Anttila
  • Publication number: 20170121818
    Abstract: A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution channel disposed within the body in a plane intersecting the longitudinal axis of the bore, and a plurality of supply channels disposed within the body and in flow communication with the first distribution channel and with the bore. Each of the first supply channels is disposed at an acute angle with respect to the longitudinal axis of the bore, and each of the supply channels connects with the bore at a different angular position about the longitudinal axis. The distribution channel (and thus, the supply channels) can be connected with a common reactant source. Related deposition methods are also described.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 4, 2017
    Inventors: Todd Dunn, Carl White, Mike Halpin, Eric Shero, Herbert Terhorst, Jerry Winkler
  • Patent number: 9574268
    Abstract: A vapor deposition device includes a reactor including a reaction chamber and an injector for injecting vapor into the reaction chamber. The device also includes a manifold for delivering vapor to the injector. The manifold includes a manifold body having an internal bore, a first distribution channel disposed within the body in a plane intersecting the longitudinal axis of the bore, and a plurality of supply channels disposed within the body and in flow communication with the first distribution channel and with the bore. Each of the first supply channels is disposed at an acute angle with respect to the longitudinal axis of the bore, and each of the supply channels connects with the bore at a different angular position about the longitudinal axis. The distribution channel (and thus, the supply channels) can be connected with a common reactant source. Related deposition methods are also described.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: February 21, 2017
    Assignee: ASM AMERICA, INC.
    Inventors: Todd Dunn, Carl White, Mike Halpin, Eric Shero, Herbert Terhorst, Jerry Winkler
  • Patent number: 9340874
    Abstract: A reaction chamber including an upper region for processing a substrate, a lower region for loading a substrate, a susceptor movable within the reaction chamber, a first sealing member positioned on a perimeter of the susceptor, a second sealing member positioned between the upper region and the lower region, wherein the first and second sealing members are selectively engaged with one another to limit communication between the upper region and the lower region.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: May 17, 2016
    Assignee: ASM IP Holding B.V.
    Inventors: Michael Halpin, Eric Shero, Carl White, Fred Alokozai, Jerry Winkler, Todd Dunn
  • Publication number: 20160118261
    Abstract: A process for depositing titanium aluminum or tantalum aluminum thin films comprising nitrogen on a substrate in a reaction space can include at least one deposition cycle. The deposition cycle can include alternately and sequentially contacting the substrate with a vapor phase Ti or Ta precursor and a vapor phase Al precursor. At least one of the vapor phase Ti or Ta precursor and the vapor phase Al precursor may contact the substrate in the presence of a vapor phase nitrogen precursor.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 28, 2016
    Inventors: Suvi Haukka, Michael Givens, Eric Shero, Jerry Winkler, Petri Räisänen, Timo Asikainen, Chiyu Zhu, Jaakko Anttila
  • Patent number: 9299595
    Abstract: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: March 29, 2016
    Assignee: ASM IP Holding B.V.
    Inventors: Todd Dunn, Fred Alokozai, Jerry Winkler, Michael Halpin
  • Patent number: 9202727
    Abstract: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: December 1, 2015
    Assignee: ASM IP Holding
    Inventors: Todd Dunn, Carl White, Michael Halpin, Eric Shero, Jerry Winkler
  • Patent number: 9167625
    Abstract: A reaction chamber including a substrate supporting member positioned within the reaction chamber, the reaction chamber having a first region and a second region, a shield positioned within the second chamber and movable with the substrate supporting member, and wherein the shield is adjacent at least a bottom surface of the substrate supporting member.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: October 20, 2015
    Assignee: ASM IP Holding B.V.
    Inventors: Eric Shero, Michael Halpin, Jerry Winkler
  • Publication number: 20150167159
    Abstract: A reaction chamber including an upper region for processing a substrate, a lower region for loading a substrate, a susceptor movable within the reaction chamber, a first sealing member positioned on a perimeter of the susceptor, a second sealing member positioned between the upper region and the lower region, wherein the first and second sealing members are selectively engaged with one another to limit communication between the upper region and the lower region.
    Type: Application
    Filed: February 27, 2015
    Publication date: June 18, 2015
    Inventors: Michael Halpin, Eric Shero, Carl White, Fred Alokozai, Jerry Winkler, Todd Dunn
  • Patent number: 9005539
    Abstract: A reaction chamber including an upper region for processing a substrate, a lower region for loading a substrate, a susceptor movable within the reaction chamber, a first sealing member positioned on a perimeter of the susceptor, a second sealing member positioned between the upper region and the lower region, wherein the first and second sealing members are selectively engaged with one another to limit communication between the upper region and the lower region.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: April 14, 2015
    Assignee: ASM IP Holding B.V.
    Inventors: Michael Halpin, Eric Shero, Carl White, Fred Alokozai, Jerry Winkler, Todd Dunn
  • Publication number: 20150096973
    Abstract: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 9, 2015
    Inventors: Todd Dunn, Fred Alokozai, Jerry Winkler, Michael Halpin
  • Patent number: 8933375
    Abstract: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: January 13, 2015
    Assignee: ASM IP Holding B.V.
    Inventors: Todd Dunn, Fred Alokozai, Jerry Winkler, Michael Halpin
  • Publication number: 20140000843
    Abstract: A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 2, 2014
    Applicant: ASM IP Holding B.V.
    Inventors: Todd Dunn, Fred Alokozai, Jerry Winkler, Michael Halpin
  • Publication number: 20130230814
    Abstract: A substrate supporting assembly in a reaction space includes a heater, a substrate support member, and a shim positioned between the heater and the substrate support member. The shim may be removably secured between the heater and the substrate support member. The shim may further include an inner surface defining a perimeter of a gap. The gap may be further defined by a bottom surface of the substrate support member and a top surface of the heater. The substrate support member may further include a shoulder positioned radially outside of a substrate support position and wherein the shim inner surface is radially aligned with the substrate support member shoulder.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 5, 2013
    Applicant: ASM IP HOLDING B.V.
    Inventors: Todd Dunn, Carl White, Michael Halpin, Eric Shero, Jerry Winkler