Abstract: Disclosed is an eye simulator device, wherein same is a medical training aid and includes: an eyepiece having a display configured to project at least one image onto or through a convex shaped front surface of a simulated eyeball of the eyepiece; a support configured to hold the eyepiece; a simulated eyelid pivotally attached to the support; and an actuator assembly having an actuator arm and an electromagnetic (EM) coil in connection with the actuator arm, so as to control a motion of the simulated eyelid, which allows to more realistically mimic the eye, and to more intuitively mimic a motion change of the eye, and it is illustratable to show a change process of the eye by projecting an eye condition, making it easier for a student to understand.

Abstract: A die including a die body having a first body surface, a second body surface on an opposite side of the die body as the first body surface, an interconnect region adjacent to the first body surface including interconnect dielectric layers with metal lines and vias, a transistor region above the interconnect region, the metal lines and vias making electrical connections to one or more power rails of the transistor region and electrically connected to transistors of the transistor region, a power region above the transistor region including an electro-conductive film on the second body surface and TSVs in the power region, an outer end of the TSV contacting the film and an embedded end of the TSVs contacting one of the power rails. A method of manufacturing an IC package and computer with the IC package are also disclosed.

Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

Abstract: A foamable cross-linkable thermoplastic material comprises a matrix polymer of any one or a mixture of two or more of polyethylene (PE), ethylene vinyl acetate copolymer (EVA) and polypropylene (PP), a cross-linking agent, and a foaming agent. A weight ratio of the cross-linking agent to the matrix polymer is 1-5:100. A weight ratio of the foaming agent to the matrix polymer is 1-5:100. A cross-linking foaming temperature of the thermoplastic material is equal to or higher than the melting point of the matrix polymer.

Abstract: A pressure sensing device including an elongate housing configured to be at least partially inserted into a user, and that defines an external surface having a proximal end and a distal end defining a longitudinal axis therebetween. The device includes a first pressure sensor, configured to sense pressure applied to a first portion of the external surface and to convert the sensed pressure to first pressure data, and a second pressure sensor, configured to sense pressure applied to a second portion of the external surface and to convert the sensed pressure to second pressure data. Sensor is spaced, along the longitudinal axis, toward the distal end from sensor.

Abstract: A self-calibrating inspection system includes an inspection device adapted to visually inspect or measure an article placed on a carrier, and a motion actuator moving the inspection device along a predetermined motion trajectory relative to the carrier and the article placed thereon. A correction member of the system is fixedly positioned with respect to the carrier. A distance sensor is fixedly positioned relative to the inspection device and adapted to sense a first spacing between the distance sensor and the correction member during the movement of the inspection device by the motion actuator.

Abstract: A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

Abstract: A display for augmented reality (AR) includes an array of optical phased arrays (OPAs) integrated into a transparent substrate. The array of OPAs emit light encoded with four dimensional (4D) light field including 2D spatial coordinates and 2D directional coordinates to create an image of a virtual object on a retina of a viewer. By adjusting the emission directions of light beam emitted by individual OPAs in the display, the depth perception can be adjusted accordingly. The array of OPAs can also be encoded with holographic information, including intensity and phase distribution, of a virtual object to create the image of the virtual object on the retina. The AR display can further incorporate liquid crystal (LC) into the OPAs for modulating the amplitudes and relative phases of light emitted by the OPAs.

Abstract: A display for augmented reality (AR) includes an array of optical phased arrays (OPAs) integrated into a transparent substrate. The array of OPAs emit light encoded with four dimensional (4D) light field including 2D spatial coordinates and 2D directional coordinates to create an image of a virtual object on a retina of a viewer. By adjusting the emission directions of light beam emitted by individual OPAs in the display, the depth perception can be adjusted accordingly. The array of OPAs can also be encoded with holographic information, including intensity and phase distribution, of a virtual object to create the image of the virtual object on the retina. The AR display can further incorporate liquid crystal (LC) into the OPAs for modulating the amplitudes and relative phases of light emitted by the OPAs.