Patents by Inventor Jerusalem Negash

Jerusalem Negash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11070041
    Abstract: An egress seal fitting for a bulkhead penetration may comprise a housing, a driver configured to couple to the housing and define a cavity within the housing, and a seal member configured to be disposed within the cavity of the housing, wherein the driver is configured to pass a cable through the housing and apply pressure to the seal member.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: July 20, 2021
    Assignee: Raytheon Technologies Corporation
    Inventors: Eli Cole Warren, Jerusalem Negash, Kevin A. Ford
  • Publication number: 20200313416
    Abstract: An egress seal fitting for a bulkhead penetration may comprise a housing, a driver configured to couple to the housing and define a cavity within the housing, and a seal member configured to be disposed within the cavity of the housing, wherein the driver is configured to pass a cable through the housing and apply pressure to the seal member.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: ELI COLE WARREN, Jerusalem Negash, Kevin A. Ford
  • Patent number: 9726777
    Abstract: A proximity sensor includes a lead supported on an outer surface of a case structure and a sensor wire that extends from the lead and through an opening in the case structure. The sensor is formed by applying alternating layers of electrically conductive and non-conductive materials in a non-cured state. A base non-conductive layer is applied to an inner surface of the case structure around the sensor wire in a non-cured state. Once cured, a conductive layer is deposited onto the base non-conductive layer and encapsulates the sensor wire. A cover non-conductive layer is then deposited over portions of the conductive layer to insulate the conductive layer. Portions of the non-conductive layer are then removed such that an area of the conductive layer is exposed to define a sensor area.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: August 8, 2017
    Assignee: United Technologies Corporation
    Inventors: Eli Cole Warren, Jerusalem Negash