Abstract: The subject of the invention is the ribonuclease which cleaves RNA strand in DNA-RNA hybrids, wherein ribonuclease comprises fusion protein comprising catalytic domain of RNase HI (RNase HI) or derivative thereof with a zinc finger DNA-RNA hybrid binding domain, and wherein the zinc finger binding domain has the ability to bind to specific sequences in the DNA-RNA hybrid. The invention also relates to new methods for determination of the sequence preference of DNA-RNA hybrid binding protein(s) or its domain(s) and allows determining the sequence recognized by sequence specific binding protein in the DNA-RNA hybrid.

Abstract: The invention relates to a new double-stranded RNA endoribonuclease, its derivative and/or variant, which has a loop locating in and interacting with the major groove of the double-stranded RNA, exhibiting sequence specific properties in the double-stranded RNA cleavage.

Abstract: The subject of the invention is the ribonuclease which cleaves RNA strand in DNA-RNA hybrids, wherein ribonuclease comprises fusion protein comprising catalytic domain of RNase HI (RNase HI) or derivative thereof with a zinc finger DNA-RNA hybrid binding domain, and wherein the zinc finger binding domain has the ability to bind to specific sequences in the DNA-RNA hybrid. The invention also relates to new methods for determination of the sequence preference of DNA-RNA hybrid binding protein(s) or its domain(s) and allows determining the sequence recognized by sequence specific binding protein in the DNA-RNA hybrid.

Abstract: The invention relates to a new double-stranded RNA endoribonuclease, its derivative and/or variant, which has a loop locating in and interacting with the major groove of the double-stranded RNA, exhibiting sequence specific properties in the double-stranded RNA cleavage.

Abstract: A method for electroless copper-plating comprising immersing a surface to be plated in a conventional bath of an alkaline aqueous solution of a cupric salt, a complexing agent for cupric (II) ions and reducing agents which additionally contain an oxide inclusion preventing agent of the formulaR'R"N--R.sub.3 --COOHwherein R' and R" each is hydrogen or alkyl and R.sub.3 and aryl, the amino group and the carboxylic group being in para position with respect to each other. As a consequence of the addition of the agent for preventing oxide inclusions in the copper plating, the latter is provided with high ductility and this confers resistance to heat shock. Preferred embodiments of the agent for preventing oxide inclusions are p-aminobenzoic acid, p-methylaminobenzoic acid, p-dimethylaminobenzoic acid or p-aminosalicylic acid.