Abstract: A soldering apparatus is adapted for making solder connections to through-hole technology components on substantially surface mount technology printed circuit boards. Lifter assemblies raise and lower solder pump assemblies. Solder pump assemblies in turn each support a nozzle support assembly. Each nozzle support assembly in turn supports either a nozzle assembly or a wave nozzle assembly. In operation, a nozzle assembly having a solder discharge configuration indicated by, and compatible with, the pin configuration of the component to be soldered is raised by the appropriate lifter assembly. Where no nozzle assembly is appropriate for the configuration of the component to be soldered, a wave nozzle assembly is raised, and the PCB moved into position adjacent to the wave nozzle assembly.

Abstract: A machine for soldering printed circuit boards and the like includes a housing enclosing an outer process chamber having a soldering station and fluxing station enclosed therein and an inner heating chamber, in combination with input and output transport conveyors on which the circuit boards enter and exit the housing. The heating chamber includes an elevator rack assembly which transports a succession of circuit boards vertically between the input and output conveyors while subjecting the circuit boards to controlled heating. The heating chamber may also be supplied with an inert or reducing gas to facilitate or eliminate fluxing requirements. The environment within the housing is maintained by air lock doors.

Abstract: An improved fixture is provided for use in supporting a plurality of components, particularly such as electrical or electronic components having elongated conductive terminals, during solder dip process steps or the like. The fixture comprises a generally U-shaped frame adapted to support a stacked group of channel members each having a generally U-shaped cross section to include opposed side walls with aligned slots therein. The channel members are assembled on the frame with a plurality of electrical components or the like supported between the channel member side walls and with the component terminals projecting outwardly through the side wall slots. When assembled, the fixture can be oriented as required to dip the terminals into a solder or other bath while maintaining the components in spaced relation against immersion into the bath.