Patents by Inventor Jess Kerlin

Jess Kerlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a planar electronic device having a magnetic component
    Patent number: 9070509
    Abstract: A method for manufacturing a planar electronic device includes applying a non-conductive fluid polymer to a lower side of a planar substrate. The substrate includes a hole extending through the substrate. The method also includes curing the fluid polymer to form a solid centering layer on the lower side of the substrate, with the centering layer extending across the hole along the lower side of the substrate. The method further includes loading a ferrite material body into the hole of the substrate through the upper side of the substrate, embedding the ferrite material body in an encapsulating material in the hole, and forming one or more conductive loops around the ferrite material body. The ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: June 30, 2015
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: Sidharth Dalmia, Spencer Viray, Lee Harrison, Jess Kerlin, Khanh Nguyen, Steven R. Kubes
  • PLANAR ELECTRONIC DEVICE HAVING A MAGNETIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
    Publication number: 20110272094
    Abstract: A method for manufacturing a planar electronic device includes applying a non-conductive fluid polymer to a lower side of a planar substrate. The substrate includes a hole extending through the substrate. The method also includes curing the fluid polymer to form a solid centering layer on the lower side of the substrate, with the centering layer extending across the hole along the lower side of the substrate. The method further includes loading a ferrite material body into the hole of the substrate through the upper side of the substrate, embedding the ferrite material body in an encapsulating material in the hole, and forming one or more conductive loops around the ferrite material body. The ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.
    Type: Application
    Filed: February 16, 2011
    Publication date: November 10, 2011
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Sidharth Dalmia, Spencer Viray, Lee Harrison, Jess Kerlin, Khanh Nguyen, Steven R. Kubes