Abstract: A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

Abstract: A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

Abstract: Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Abstract: Embodiments introduce redundant optical channels to significantly extend the lifetime of parallel optical transceivers. A plurality of transmitters, N, transmit on a plurality of optical channels, where N is an integer number of optical channels greater than 1. One or more redundant channels, M, are also provided. N+M multiple input shift registers provide multiple paths for signals from each of the transmitters to connect to N+M laser diodes. In the event up to M of the N+M laser diodes fail, the multiple input shift registers connect the N transmitters to functioning ones of the N+M laser diodes thus extending the life of the device. A corresponding scheme is also described for the receiver side.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: A monolithic cable assembly includes a communication cable and cable connectors coupled to either end of the communication cable. The communication cable includes at least one optical communication channel. The cable connectors include a physical end connector for electrically coupling to a data device connector, optoelectronic components for converting data signals between an electrical realm and an optical realm, and a passively aligned integrated lens cover. The integrated lens cover includes at least one optical pathway for coupling optical data signals between the at least one optical communication channel and the optoelectronic components.

Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

Abstract: A transceiver assembly includes a frame section, a rigid printed circuit board, a flex circuit, and an edge connector. The frame section includes a flex circuit layer for use in carrying data, and control and power signals, and an optoelectronic device. The rigid printed circuit board includes a first rigid printed circuit board layer and a flex circuit layer for use in carrying data, and control and power signals. The flex circuit is for carrying data, and control and power signals which flexibly links the rigid printed circuit board to the frame section and forms the flex circuit layers in the rigid printed circuit board and the frame section. The edge connector is formed on one end of the printed circuit board by a plurality of connection pads disposed along one edge of the printed circuit board.

Abstract: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

Abstract: A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.

Abstract: An optoelectronic subassembly includes a planar substrate, a set of guide pins, and a support block. The planar substrate has an array of photoactive components mounted on the planar substrate and a set of apertures in the planar substrate are aligned with the photoactive components. The set of guide pins have proximal and distal ends extending through the set of apertures in the planar substrate. The support block includes a set of support passages in which the distal ends of the guide pins are cemented, and a support face which is at right angles to the set of support passages. The optoelectronic subassembly is for use in a fiber optic communications transceiver which is adapted for being mechanically and optically connected to an optical ferrule. The optical ferrule supports an array of optical communications fibers.

Abstract: A programmable laser driver may be programmed to meet the characteristics of a particular laser. Traditionally, external resistors are used to bias the driver and program the value of the drive current to suit a particular laser. Embodiments of the present invention comprise integrating a plurality of resistors with the IC driver and providing a bonding bad for each resistor. Thus, different drive currents may be selectable based on different bonding patterns corresponding to different bias resistance selections. These bond options allow the selection of different ranges of bias current, modulation current and temperature coefficients necessary to drive various lasers.

Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.

Abstract: A laser driver for generating drive waveforms that are suitable for driving a single VCSEL or an array of VCSELs. A digital controller is integrated into the laser driver and is utilized to initially program and selectively adjust during the operation of the driver one or more of the following VCSEL drive waveform parameters: (1) bias current, (2) modulation current, (3) negative peaking depth, and (4) negative peaking duration. The laser driver has an aging compensation mechanism for monitoring the age of the laser and for selectively adjusting the dc and ac parameters of the VCSEL drive waveform to compensate for the aging of the laser. The laser driver also has a temperature compensation mechanism for monitoring the temperature of the driver IC and selectively adjusting the dc and ac parameters of the VCSEL drive waveform to compensate for the changes in temperature.

Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.

Abstract: A subassembly for use in fiber optic communications systems where multiple optical fibers are used in either transmitting or receiving optical signals. The subassembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The subassembly uses a carrier assembly to support an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The subassembly includes a lens and alignment frame having a set of guide pins and an array of lenses for interfacing the fibers of the ferrule with the photoactive components of the optoelectronic device on the carrier assembly. The carrier assembly may also include signal processing devices and a circuit board having an edge connector for removably connecting the subassembly with a computer or communications system.

Abstract: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule.