Abstract: A wafer-type electromagnetic flow sensor includes a single-piece chassis having a pair of faces and a flow conduit extending between the pair of faces. Each face of the chasses includes a feature configured to engage a metal sealing ring. A non-conductive liner is disposed in the flow conduit of the single-piece chassis. A plurality of electromagnetic coils is configured to generate a flux into process fluid flowing through the flow conduit. A pair of electrodes is configured to electrically couple to the process fluid. A feedthrough assembly is configured to maintain process fluid pressure while allowing a plurality of electrical conductors to pass therethrough.

Abstract: A process instrument having a wafer-style body for mounting between an upstream flanged pipe and a downstream flanged pipe has a flow passage, a transmitter connected to the body, and first and second end plates fixed to the body. The first end plate has a first set of cams for engaging a plurality of threaded fasteners extending between the upstream flanged pipe and the downstream flanged pipe. The second end plate has a second set of cams for engaging the plurality of threaded fasteners such that the first set of cams and the second set of cams center the flow passage with respect to the upstream flanged pipe and the downstream flanged pipe.