Abstract: Shaped charge devices, systems, and related methods of use. A housing sheet is configurable to form at least part of a shaped charge enclosure enclosing a shaped charge and biasing an explosion in a desired direction. The housing sheet can include one or more incisions in at least one surface thereof. The housing sheet can have at least one connection mechanism integrally formed therein, and the housing sheet can be configurable to form a plurality of sizes of shaped charge housing portions. The housing sheet can also provide for forming a plurality of dimensions of the shaped charge enclosure.

Abstract: The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.