Abstract: Shaped charge devices, systems, and related methods of use. A housing sheet is configurable to form at least part of a shaped charge enclosure enclosing a shaped charge and biasing an explosion in a desired direction. The housing sheet can include one or more incisions in at least one surface thereof. The housing sheet can have at least one connection mechanism integrally formed therein, and the housing sheet can be configurable to form a plurality of sizes of shaped charge housing portions. The housing sheet can also provide for forming a plurality of dimensions of the shaped charge enclosure.

Abstract: Semiconductor package lid thermal interface material standoffs are disclosed and may include a substrate, a semiconductor die bonded to the substrate, a package lid bonded to the substrate and the semiconductor die thermal interface material in contact the semiconductor die, and standoffs that define a distance between the package lid and the substrate. The package lid may comprise thermal conducting material. The standoff may be within a portion of the thermal interface material. The package lid may provide a hermetic seal with the substrate. A passive device may be bonded to the substrate and covered by the package lid. A standoffs may also be formed on portions of the lid that are not in contact with the substrate. The standoff may be formed on four edges of the package lid. The standoff may comprise structures pressed into the lid.

Abstract: A semiconductor package which is structured to allow for the edge mounting thereof in a vertical mount orientation. The semiconductor package comprises a flexible substrate or “flex circuit.” The flexible substrate includes a conductive pattern disposed on a first surface thereof, and a plurality of conductive pads or terminals disposed on a second surface thereof which is disposed in opposed relation to the first surface. Mounted to the first surface of the flexible substrate are one or more electronic components such as semiconductor dies. The semiconductor die(s) is/are electrically connected to the conductive pattern, and thereafter covered or encapsulated by a package body applied to a portion of the first surface of the flexible substrate. That portion of the flexible substrate including the conductive pads or terminals formed on the second surface thereof is thereafter folded and adhered to a portion of the package body through the use of a suitable adhesive.

Abstract: A semiconductor device has a substrate having a top and bottom surface and a plurality of metal layers. A first die is electrically coupled to the top surface of the substrate. A lid member is attached to a top surface of the die and to the top surface of the substrate. A layering is formed on portions of a top surface of the lid member. The layering will have a different coefficient of thermal expansion (CTE) than the lid member.

Abstract: A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) (20) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints, or joints in the vicinity of the worst case joints, are changed in pad dimension and exposed to more ball/bump conductive material than the other more robust joints (14) in the IC (20) to create a ball (24) on a larger pad (22) that is larger than the normal sized ball (14). The larger balls (24) are formed by placing multiple smaller balls (14) together on a single pad (22) to form one larger ball (24) during a reflow operation. The larger ball (24) improves the overall IC reliability by improving the reliability of the weakest joints in the IC design. In addition, the standoff of both the larger balls (24) and the smaller balls (14) are engineered to be substantially equal.

Abstract: A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) (20) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints, or joints in the vicinity of the worst case joints, are changed in pad dimension and exposed to more ball/bump conductive material than the other more robust joints (14) in the IC (20) to create a ball (24) on a larger pad (22) that is larger than the normal sized ball (14). The larger balls (24) are formed by placing multiple smaller balls (14) together on a single pad (22) to form one larger ball (24) during a reflow operation. The larger ball (24) improves the overall IC reliability by improving the reliability of the weakest joints in the IC design. In addition, the standoff of both the larger balls (24) and the smaller balls (14) are engineered to be substantially equal.

Abstract: An intercooled electronic device, includes a thermally conductive chassis (110), a substrate (120) mounted onto the chassis (110), a housing (104) formed around the chassis (110), and a cooling fan (130) mounted internally within the housing (104). The substrate (120) carries electrical circuitry including at least one heat-generating component (122) which is thermally coupled to the chassis (110). The cooling fan (130) is oriented to direct air across the chassis (110).