Abstract: The disclosed system includes a user-mountable electronic device, an output interface, and at least one processor. The electronic device includes a housing and at least one sensor device located within the housing and configured to generate sensor output that indicates orientation or motion of the user-mountable electronic device. The at least one processor is operated to: receive the sensor output; identify, based on the received sensor output, a body part on which the user intends to deploy the user-mountable electronic device; determine a preferred orientation of the user-mountable electronic device relative to the identified body part; and cause the output interface to provide deployment guidance that indicates the preferred orientation of the user-mountable electronic device.

Abstract: Wearable medical devices are provided. An exemplary wearable medical device includes a flexible printed circuit board assembly (PCBA), a battery cell having a first terminal and a second terminal, a sensor, and a uniaxially electrically conductive adhesive electrically connected to the flexible PCBA, to the first terminal and the second terminal of the battery cell, and to the sensor.

Abstract: A method of measuring a physiological characteristic of a user obtains first calibrating sensor data indicative of an analyte level of the user, and produced in response to operation of a continuous analyte sensor device during a calibration period, and obtains second calibrating sensor data indicative of status or condition of the user, and produced in response to operation of a noninvasive sensor device, concurrently with operation of the continuous analyte sensor device, during the calibration period. A correlation measurement is calculated by comparing the first calibrating sensor data against the second calibrating sensor data. When the correlation measurement exceeds a threshold value, a transfer function is generated to calculate estimated values of the analyte level as a function of sensor data from the noninvasive sensor device. The transfer function is provided to a client device associated with the user.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the second electrical path and that is selectively electrically couplable to the first electrical path.

Abstract: A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the first electrical path in the retracted mode and that is electrically coupled to the second electrical path in the extended mode.

Abstract: A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the first electrical path in the retracted mode and that is electrically coupled to the second electrical path in the extended mode.

Abstract: A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the second electrical path and that is selectively electrically couplable to the first electrical path.

Abstract: A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via.

Abstract: A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via.

Abstract: A method and apparatus implement reduced noise coupling effects on single ended clocks, and a design structure on which the subject circuit resides is provided. A clock receiver includes a clock voltage reference that is generated from received clock peaks and valleys of a received input clock signal. The received clock peaks (VT) and the received clock valleys (VB) are continuously sampled. The clock voltage reference is set, for example, equal to an average of VT and VB; or ((VT+VB)/2).

Abstract: Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the slurry comprising a magnetic material, an electrically conducting material, or a combination comprising at least one of the foregoing materials; filling the first hole with a fill material; the fill material being electrically insulating; laminating a first layer and a second layer on opposing faces of the multilayered device to form a laminate; the opposing faces being the faces through which the first hole is drilled; the first layer and the second layer each comprising a second electrically conducting material; drilling a second hole through the laminate; the second hole having a circumference that is encompassed by a circumference of the first hole; and plating the surface of the secon