Patents by Inventor Jesse L. Pedigo
Jesse L. Pedigo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7066378Abstract: A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.Type: GrantFiled: June 25, 2002Date of Patent: June 27, 2006Assignee: TTM Advanced Circuits, Inc.Inventor: Jesse L. Pedigo
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Patent number: 6995321Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.Type: GrantFiled: January 3, 2002Date of Patent: February 7, 2006Assignee: Honeywell Advanced CircuitsInventors: Bruce W. Lee, Jesse L. Pedigo
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Patent number: 6921505Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.Type: GrantFiled: January 3, 2002Date of Patent: July 26, 2005Assignee: TTM Advanced Circuits, Inc.Inventors: Bruce W. Lee, Jesse L. Pedigo
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Patent number: 6840425Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.Type: GrantFiled: December 20, 2001Date of Patent: January 11, 2005Assignee: TTM Advanced Circuits, Inc.Inventor: Jesse L. Pedigo
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Patent number: 6814918Abstract: A method for filling vias in an electronic substrate which includes providing a source of fill material; providing a pressure head coupled to the source of fill material via a fill material inlet, the pressure head further comprising an elongated fill material outlet which is substantially larger than the fill material inlet; placing the pressure head in contact with the electronic substrate; and pressurizing the fill material to inject fill material into the vias of the electronic substrate.Type: GrantFiled: November 18, 2002Date of Patent: November 9, 2004Assignee: TTM Advanced Circuits, Inc.Inventor: Jesse L. Pedigo
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Patent number: 6793852Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.Type: GrantFiled: December 20, 2001Date of Patent: September 21, 2004Assignee: TTM Advanced Circuits, Inc.Inventor: Jesse L. Pedigo
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Publication number: 20030127777Abstract: A method for filling vias in an electronic substrate which includes providing a source of fill material; providing a pressure head coupled to the source of fill material via a fill material inlet, the pressure head further comprising an elongated fill material outlet which is substantially larger than the fill material inlet; placing the pressure head in contact with the electronic substrate; and pressurizing the fill material to inject fill material into the vias of the electronic substrate.Type: ApplicationFiled: November 18, 2002Publication date: July 10, 2003Inventor: Jesse L. Pedigo
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Publication number: 20030057253Abstract: A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.Type: ApplicationFiled: June 25, 2002Publication date: March 27, 2003Inventor: Jesse L. Pedigo
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Patent number: 6506332Abstract: A method for filling vias in an electronic substrate which includes providing a source of fill material; providing a pressure head coupled to the source of fill material via a fill material inlet, the pressure head further comprising an elongated fill material outlet which is substantially larger than the fill material inlet; placing the pressure head in contact with the electronic substrate; and pressurizing the fill material to inject fill material into the vias of the electronic substrate.Type: GrantFiled: December 28, 2000Date of Patent: January 14, 2003Assignee: Honeywell International Inc.Inventor: Jesse L. Pedigo
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Patent number: 6454154Abstract: A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.Type: GrantFiled: December 28, 2000Date of Patent: September 24, 2002Assignee: Honeywell Advanced Circuits, Inc.Inventor: Jesse L. Pedigo
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Publication number: 20020113330Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.Type: ApplicationFiled: December 20, 2001Publication date: August 22, 2002Inventor: Jesse L. Pedigo
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Publication number: 20020089086Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.Type: ApplicationFiled: January 3, 2002Publication date: July 11, 2002Inventors: Bruce W. Lee, Jesse L. Pedigo
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Publication number: 20020084305Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.Type: ApplicationFiled: December 20, 2001Publication date: July 4, 2002Inventor: Jesse L. Pedigo
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Publication number: 20020084306Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.Type: ApplicationFiled: January 3, 2002Publication date: July 4, 2002Inventors: Bruce W. Lee, Jesse L. Pedigo
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Patent number: 6312621Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.Type: GrantFiled: November 12, 1999Date of Patent: November 6, 2001Assignee: Johnson Matthey Electronics, Inc.Inventors: Jesse L. Pedigo, Nancy E. Iwamoto, Alan Grieve, Xiao-Qi Zhou
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Patent number: 5859110Abstract: A method is described for decreasing bleed from an organic-based formulation comprising incorporating in the organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.6 angstroms; (b) a ratio of formula weight to number of heavy atom bonds of 13 to 16 grams; (c) a ratio of formula weight to end-to-end distance of 18 to 22 grams/angstrom; (d) a ratio of heavy atoms to heavy atom bonds of 1 to 1.1; (e) a ratio of weight fraction of carbon to formula weight of 0.7 to 0.95; (f) a ratio of formula weight to number of carbon to carbon bonds of 14 to 20 grams; and/or (g) 1 to 2 heteroatoms.Also described as an organic-based formulation is disclosed that comprises a filler, a resin and an organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.Type: GrantFiled: September 23, 1997Date of Patent: January 12, 1999Assignee: Johnson Matthey, Inc.Inventors: Nancy E. Iwamoto, Jesse L. Pedigo
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Patent number: 5783621Abstract: A method is described for determining high performing anti-bleed agents by comparing the structural characteristics of a compound to specified ranges of structurally-based variables. These structurally-based variables are determined by first comparing the structural characteristics of the best performing anti-bleed agents in a first set of computer simulations of anti-bleed agent candidates in a die attach adhesive on a substrate. The effects of other anti-bleed agent candidates are determined by plotting the structurally-based variables against modeled bleed. Predictive ranges are determined by the performance groups of the candidates with the coincidentally lowest bleed. Also disclosed are organic-based formulations suitable for assembling semiconductor devices including die attach adhesive useful for bonding a semiconductor device to a substrate that incorporates selected anti-bleed agents and which may additionally contain a filler.Type: GrantFiled: June 10, 1996Date of Patent: July 21, 1998Assignee: Johnson Matthey, Inc.Inventors: Nancy E. Iwamoto, Jesse L. Pedigo
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Patent number: 5744533Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.Type: GrantFiled: June 4, 1997Date of Patent: April 28, 1998Assignee: Johnson Matthey, Inc.Inventors: Nancy E. Iwamoto, Jesse L. Pedigo, Shao Wei Li, Alan Grieve