Abstract: A sensor assembly for sensing a physiological characteristic of a user includes a power source, a power control switch, and a power latch within a housing. The power control switch is electrically coupled to the power source, and is configured to inhibit delivery of power from the power source to one or more components of the sensor assembly before deployment of the sensor assembly to a user, and deliver power from the power source to the one or more components of the sensor assembly in response to the deployment of the sensor assembly to the user. The power latch is configured to, upon the deployment of the sensor assembly to the user, latch an output of the power control switch to maintain the delivery of power from the power source to the one or more components of the sensor assembly while the sensor assembly is in a deployed state.

Abstract: A sensor assembly for sensing a physiological characteristic of a user includes a power source, a power control switch, and a power latch within a housing. The power control switch is electrically coupled to the power source, and is configured to inhibit delivery of power from the power source to one or more components of the sensor assembly before deployment of the sensor assembly to a user, and deliver power from the power source to the one or more components of the sensor assembly in response to the deployment of the sensor assembly to the user. The power latch is configured to, upon the deployment of the sensor assembly to the user, latch an output of the power control switch to maintain the delivery of power from the power source to the one or more components of the sensor assembly while the sensor assembly is in a deployed state.

Abstract: A sensor assembly for sensing a physiological characteristic includes a power source, a power control switch, and a power latch configured to latch an output of the power control switch. The sensor assembly also includes a power converter coupled to the power control switch. The power converter is configured to step down a voltage of the latched output of the power control switch for delivery of the latched output to one or more components of the sensor assembly. The power control switch is configured to inhibit consumption of power from the power source when the sensor assembly is in a pre-deployment state and output the latched output to the power converter in response to transition of the sensor assembly from the pre-deployment state to a deployed state.

Abstract: A sensor assembly for sensing a physiological characteristic includes a power source configured to deliver power to one or more components of an electrical subsystem upon deployment of the sensor assembly to a user. A power latch is configured to latch an output of a power control switch for delivery to one or more components of the electrical subsystem upon deployment of the sensor assembly to a user. The power control switch is configured to inhibit delivery of power to the electrical subsystem prior to deployment of the sensor assembly to a user and to deliver the latched output to one or more components of the electrical subsystem in response to deployment of the sensor assembly to a user.

Abstract: A sensor assembly for sensing a physiological characteristic includes a power source, a power control switch, and a power latch configured to latch an output of the power control switch. The sensor assembly also includes a power converter coupled to the power control switch. The power converter is configured to step down a voltage of the latched output of the power control switch for delivery of the latched output to one or more components of the sensor assembly. The power control switch is configured to inhibit consumption of power from the power source when the sensor assembly is in a pre-deployment state and output the latched output to the power converter in response to transition of the sensor assembly from the pre-deployment state to a deployed state.

Abstract: A sensor assembly for sensing a physiological characteristic includes a power source configured to deliver power to one or more components of an electrical subsystem upon deployment of the sensor assembly to a user. A power latch is configured to latch an output of a power control switch for delivery to one or more components of the electrical subsystem upon deployment of the sensor assembly to a user. The power control switch is configured to inhibit delivery of power to the electrical subsystem prior to deployment of the sensor assembly to a user and to deliver the latched output to one or more components of the electrical subsystem in response to deployment of the sensor assembly to a user.

Abstract: A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.

Abstract: A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.

Abstract: A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer has a plurality of signal pads thereon. The second sub-circuit board includes an edge with an inverse stair-step profile interconnection. A pad-on-pad connector is positioned in-between and electrically interconnects the respective signal layers on each sub-circuit board.

Abstract: A device to access and/or verify connections between a chip package and a printed circuit board (“PCB”), specifically within packages lacking back-side measurement access, includes a housing for insertion between the chip package and PCB. A passageway in the housing connects an entrance and an exit from the housing. The entrance is disposed on an end of the housing facing away from the chip package. The exit is disposed on a side of the housing below the chip package such that the passageway is directed at a signal path between the chip package and the PCB. A conductor disposed in the passageway is movable between a retracted position in which a contact end of the conductor is disposed within the passageway of the housing and an extended position in which the contact end of the conductor is disposed outside of the housing and in contact with the signal path.

Abstract: Methods and systems for controlled formation of a resist in a via. In one embodiment, a method for plating at least a portion of the inside of a via formed in an object may include filling the via with a resist capable of selective three-dimensional polymerization. The resist may be selectively polymerized, and developed. When the resist is developed, only a portion of the resist is removed according to whether the portion is polymerized, thereby leaving a remaining portion in the via and forming a desired structure in the via.