Abstract: A method is described for preparing opto-electronic devices such as organic light-emitting diodes. The method is a thermal dye transfer process in which a dye pattern is transferred from a dye transfer plate into a receiving layer of a substrate by bringing the dye transfer plate into contact with the receiving layer and heating to a relatively low temperature, preferably below the vaporization or sublimation temperature of the dye. The pattern of the dye is maintained upon transfer and diffusion. Preferably, the method is repeated to provide a three-color pattern in the receiving layer. The invention also encompasses an opto-electronic device comprising a receiving layer as prepared by the aforementioned method wherein the receiving layer is sandwiched between two electrodes, one of which is transparent. Optionally, a hole-transporting or electron-transporting layer can be deposited between each electrode and the receiving layer.

Abstract: The invention relates to an encapsulated organic light emitting device having an improved protective covering comprising a first layer of passivating metal, a second layer of an inorganic dielectric material and a third layer of polymer.