Patents by Inventor Jesse T. Dybenko

Jesse T. Dybenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250240912
    Abstract: A fan assembly includes a base with multiple layers with at least one layer formed from a relatively lightweight material to reduce the overall weight of the fan assembly. The base may include multiple metal layers and one or more core layers positioned between the metal layers. At least one of the core layers may include a PCB used to route electrical signals between components of the fan assembly and/or between components of an electronic device in which the fan assembly is positioned. Alternatively, at least one of the core layers may include a lightweight material (e.g., plastic) with a channel used to receive a flexible circuit. The base, having layers of different materials, may be lighter in weight as compared to a base consisting of a metal layer (or metal layers), while also substantially retaining flexural stiffness to counter against applied forces to the base.
    Type: Application
    Filed: January 18, 2024
    Publication date: July 24, 2025
    Inventors: Anthony J. AIELLO, Akash H. THAKER, Anton TALALAYEV, Ashkan RASOULI, Brett W. DEGNER, Jesse T. DYBENKO, Nicholas A. RUNDLE, Simon S. LEE
  • Publication number: 20250240913
    Abstract: A fan assembly includes one or more electrically conductive assemblies designed to provide electrical signals and/or power to electrical components external to the fan assembly. The one or more electrically conductive assemblies are embedded in the base of the fan assembly. A fan assembly with embedded electrically conductive assemblies can electrically couple with a main logic board carrying circuits (e.g., logic circuitry or control circuitry), as well as an input-output board. As a result, the circuitry on the main logic board may provide instructions or commands to one or more electrical components carried by the input-output board. Using the one or more electrically conductive assemblies, electronic device may require fewer flexible circuits.
    Type: Application
    Filed: August 23, 2024
    Publication date: July 24, 2025
    Inventors: Anthony J. AIELLO, Akash H. THAKER, Anton TALALAYEV, Ashkan RASOULI, Brett W. DEGNER, Jesse T. DYBENKO, Nicholas A. RUNDLE, Simon S. LEE, Jonah R. ARNHEIM
  • Publication number: 20250067979
    Abstract: A head-mountable device can include an outer frame that can define a first opening, a second opening an internal volume between the first opening and the second opening, an intake port between the first opening and the second opening, and an exhaust port between the first opening and the second opening. In some examples, a front cover assembly can be disposed in the first opening. An inner frame can be coupled to the outer frame, where the inner frame can also define a first aperture and a second aperture. In some examples, a curtain assembly can occlude the second opening. Furthermore, the curtain assembly can include an elastic layer that can define an external surface. The curtain assembly can also include an air-impermeable layer that can define the internal volume.
    Type: Application
    Filed: July 3, 2024
    Publication date: February 27, 2025
    Inventors: David J. Dunsmoor, Enoch Mylabathula, Jesse T. Dybenko, Laura M. Campo, Sivesh Selvakumar
  • Patent number: 12238909
    Abstract: An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: February 25, 2025
    Assignee: APPLE INC.
    Inventors: David J. Dunsmoor, Enoch Mylabathula, Jason C. Sauers, Jesse T. Dybenko, Laura M. Campo
  • Publication number: 20240397680
    Abstract: An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.
    Type: Application
    Filed: September 29, 2023
    Publication date: November 28, 2024
    Inventors: David J. Dunsmoor, Enoch Mylabathula, Jason C. Sauers, Jesse T. Dybenko, Laura M. Campo
  • Publication number: 20240389287
    Abstract: An electronic device includes an external frame defining an internal volume, an air inlet port, and an air exhaust port. The electronic device also includes a fan configured to draw air into the internal volume through the inlet port and push air out from the internal volume through the exhaust port, the fan including a housing. The housing defines a fan inlet and a fan outlet and the air inlet port, the fan inlet, the fan outlet, and the air exhaust port define an airflow path with the air inlet port upstream from the fan inlet, the fan inlet upstream from the fan outlet, and the fan outlet upstream from the air exhaust port. The electronic device also includes a display assembly disposed in the internal volume, the airflow path defined between the display assembly and the fan inlet and an internal frame coupled to the external frame, the internal frame disposed between the display assembly and the fan and defining an opening aligned with the fan inlet.
    Type: Application
    Filed: September 29, 2023
    Publication date: November 21, 2024
    Inventors: David J. Dunsmoor, Enoch Mylabathula, Jesse T. Dybenko, Laura M. Campo, Sivesh Selvakumar
  • Patent number: 12101918
    Abstract: A head-mounted device can effectively manage heat while also managing noise output in a manner that reduces the user's perception thereof. For example, a support member extending across a flow channel can provide multiple sections with different profiles and/or cross-sectional dimensions within the flow channel. Each of the profiles and/or cross-sectional dimensions can generate tonal noises at different frequencies, so that the tonal noises generated are distributed across multiple frequencies to mask such tonal noises among broadband noises that are generated by the head-mounted device. Such a support member can be moveably positioned within the flow channel and rigidly coupled to other components of the head-mounted device. Such a support member can also be used to draw heat away from other components of the head-mounted device to be dissipated by the flow of air within the flow channel.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: September 24, 2024
    Assignee: Apple Inc.
    Inventors: Ivan S. Marić, Aidan N Zimmerman, Phil M. Hobson, Jonathan C Atler, Arash Naghib Lahouti, Jesse T. Dybenko
  • Patent number: 12075597
    Abstract: A head-mountable device can include an outer frame that can define a first opening, a second opening an internal volume between the first opening and the second opening, an intake port between the first opening and the second opening, and an exhaust port between the first opening and the second opening. In some examples, a front cover assembly can be disposed in the first opening. An inner frame can be coupled to the outer frame, where the inner frame can also define a first aperture and a second aperture. In some examples, a curtain assembly can occlude the second opening. Furthermore, the curtain assembly can include an elastic layer that can define an external surface. The curtain assembly can also include an air-impermeable layer that can define the internal volume.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: August 27, 2024
    Assignee: APPLE INC.
    Inventors: David J. Dunsmoor, Enoch Mylabathula, Jesse T. Dybenko, Laura M. Campo, Sivesh Selvakumar
  • Publication number: 20240068484
    Abstract: A head-mountable device can include a fan that effectively manages heat while also mitigating the intrusion of particles and other debris. Fans can include a protrusion that creates a tortuous pathway to direct incoming particles away from sensitive regions. Fans can include openings to allow particles to exit the fan enclosure and avoid interaction with the impeller. Fans can include a variable spacing between the impeller and the base plate to avoid collection of particles. Fans can include an adhesive pad that collects and retains particles at a location that does not interfere with rotation of the impeller.
    Type: Application
    Filed: July 21, 2023
    Publication date: February 29, 2024
    Inventors: Jesse T. DYBENKO, Arash NAGHIB LAHOUTI, Jason C. SAUERS, Jeffrey R. KAPPER, Sivesh SELVAKUMAR, David J. DUNSMOOR
  • Publication number: 20230363123
    Abstract: A head-mounted device can effectively manage heat while also managing noise output in a manner that reduces the user's perception thereof. For example, a support member extending across a flow channel can provide multiple sections with different profiles and/or cross-sectional dimensions within the flow channel. Each of the profiles and/or cross-sectional dimensions can generate tonal noises at different frequencies, so that the tonal noises generated are distributed across multiple frequencies to mask such tonal noises among broadband noises that are generated by the head-mounted device. Such a support member can be moveably positioned within the flow channel and rigidly coupled to other components of the head-mounted device. Such a support member can also be used to draw heat away from other components of the head-mounted device to be dissipated by the flow of air within the flow channel.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Inventors: Ivan S. MARIC, Aidan N. ZIMMERMAN, Phil M. HOBSON, Jonathan C. ATLER, Arash NAGHIB LAHOUTI, Jesse T. DYBENKO
  • Patent number: 11758702
    Abstract: A head-mounted device can effectively manage heat while also managing noise output in a manner that reduces the user's perception thereof. For example, a support member extending across a flow channel can provide multiple sections with different profiles and/or cross-sectional dimensions within the flow channel. Each of the profiles and/or cross-sectional dimensions can generate tonal noises at different frequencies, so that the tonal noises generated are distributed across multiple frequencies to mask such tonal noises among broadband noises that are generated by the head-mounted device. Such a support member can be moveably positioned within the flow channel and rigidly coupled to other components of the head-mounted device. Such a support member can also be used to draw heat away from other components of the head-mounted device to be dissipated by the flow of air within the flow channel.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: September 12, 2023
    Assignee: Apple Inc.
    Inventors: Ivan S. Marić, Aidan N. Zimmerman, Phil M. Hobson, Jonathan C. Atler, Arash Naghib Lahouti, Jesse T. Dybenko
  • Patent number: 11723172
    Abstract: Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: August 8, 2023
    Assignee: APPLE INC.
    Inventors: Anthony Joseph Aiello, Brett W. Degner, Jesse T. Dybenko, Arash Naghib Lahouti, Eric R. Prather
  • Patent number: 11716829
    Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 1, 2023
    Assignee: Apple Inc.
    Inventors: Cheng P. Tan, Sivesh Selvakumar, Jesse T. Dybenko, Enoch Mylabathula, Jason C. Sauers, Phil M. Hobson, Laura M. Campo, Dragos Moroianu
  • Publication number: 20220394889
    Abstract: A head-mounted device can effectively manage heat while also managing noise output in a manner that reduces the user's perception thereof. For example, a support member extending across a flow channel can provide multiple sections with different profiles and/or cross-sectional dimensions within the flow channel. Each of the profiles and/or cross-sectional dimensions can generate tonal noises at different frequencies, so that the tonal noises generated are distributed across multiple frequencies to mask such tonal noises among broadband noises that are generated by the head-mounted device. Such a support member can be moveably positioned within the flow channel and rigidly coupled to other components of the head-mounted device. Such a support member can also be used to draw heat away from other components of the head-mounted device to be dissipated by the flow of air within the flow channel.
    Type: Application
    Filed: February 5, 2020
    Publication date: December 8, 2022
    Inventors: Ivan S. Maric, Aidan N. Zimmerman, Phil M. Hobson, Jonathan C. Atler, Arash Naghib Lahouti, Jesse T. Dybenko
  • Publication number: 20220287202
    Abstract: Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.
    Type: Application
    Filed: September 23, 2021
    Publication date: September 8, 2022
    Inventors: Anthony Joseph AIELLO, Brett W. DEGNER, Jesse T. DYBENKO, Arash NAGHIB LAHOUTI, Eric R. PRATHER
  • Patent number: 11375647
    Abstract: An electronic device includes a fan assembly that draws air (including heated air) away from components and forces the air out of the electronic device. The fan assembly includes a guide vane located in the fan housing. Subsequent to air entering the fan assembly via the fan inlets, the guide vane is designed to direct the air to a fan outlet. Further, the guide vane is designed and positioned in the fan assembly to limit or prevent flow separation that may cause the heated air to recirculate and may also cause increased turbulence leading to elevated acoustic noise. Furthermore, the guide vane may include a tapered region to allow the heated air to readily flow over the guide vane to limit or prevent a vortex from occurring within the fan assembly. Using the guide vane, the fan assembly drives more air at the same fan speed and lowers noise generation.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 28, 2022
    Assignee: Apple Inc.
    Inventors: Arash Naghib Lahouti, Jesse T. Dybenko, Anthony Joseph Aiello
  • Patent number: 11339793
    Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 24, 2022
    Assignee: Apple Inc.
    Inventors: Anthony J. Aiello, Cheng P. Tan, Jesse T. Dybenko, Arash Naghib Lahouti, Eric R. Prather, Philippe P. Herrou, Ashkan Rasouli, Brett W. Degner, Michael E. LeClerc
  • Patent number: 11333170
    Abstract: A cooling system for optimizing fan air flow performance without compromising acoustic performance is disclosed. At least three fan feature embodiments are disclosed: (1) sloped fan blades, (2) sloped impeller hubs, and (3) inlet flow guidance features. For the first embodiment, fan blades attached to an impeller disc and having leading edges that progressively curve toward a center of the impeller disc. For the second embodiment, the impeller disc is attached to and centered on an impeller hub that has a sloped hub surface that progressively curves toward the fan blades. For the third embodiment, an inlet flow guidance feature is positioned within a region surrounding a fan's inlet promoting smooth passage of air into the fan. In some embodiments, all three fan features are combined.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: May 17, 2022
    Assignee: Apple Inc.
    Inventors: Anthony Joseph Aiello, Jesse T. Dybenko, Richard A. Herms
  • Patent number: 11215193
    Abstract: An electronic device with a fan assembly is disclosed. The fan assembly includes an impeller and an insert separated from the impeller by a gap. The fan assembly increases airflow by rotationally driving the impeller. For a sufficient rotational speed of the impeller, the airflow reaches a level that provides a force that displaces the insert. The displacement may include movement and/or compression of the insert. As a result of the displacement, the gap between the impeller and the insert increases. The increased gap reduces the pressure and associated noise that is otherwise caused by the airflow. When the rotational speed of the impeller reduces or ceases, the insert returns to its initial position. In this manner, the fan assembly includes a self-adjusting gap that changes based on the airflow.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: January 4, 2022
    Assignee: Apple Inc.
    Inventors: Halil Berberoglu, Cheng Ping Tan, Arash Naghib Lahouti, Richard A. Herms, Jesse T. Dybenko, Ashkan Rasouli
  • Publication number: 20210095692
    Abstract: An electronic device with a fan assembly is disclosed. The fan assembly includes an impeller and an insert separated from the impeller by a gap. The fan assembly increases airflow by rotationally driving the impeller. For a sufficient rotational speed of the impeller, the airflow reaches a level that provides a force that displaces the insert. The displacement may include movement and/or compression of the insert. As a result of the displacement, the gap between the impeller and the insert increases. The increased gap reduces the pressure and associated noise that is otherwise caused by the airflow. When the rotational speed of the impeller reduces or ceases, the insert returns to its initial position. In this manner, the fan assembly includes a self-adjusting gap that changes based on the airflow.
    Type: Application
    Filed: February 14, 2020
    Publication date: April 1, 2021
    Inventors: Halil BERBEROGLU, Cheng Ping TAN, Arash NAGHIB LAHOUTI, Richard A. HERMS, Jesse T. DYBENKO, Ashkan RASOULI